Camera Module Grounding Structure for EMI Shielding
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Solution Overview
Problem
High resolution camera modules in digital devices are susceptible to electromagnetic interference due to the presence of semiconductor devices, which existing technologies have not effectively addressed.
Innovation Solution
A camera module design that includes an image sensor chip with a substrate having a ground pad on one surface and an optical unit within a housing, where an electromagnetic wave-shielding film is integrated with the housing and an electrical conductor connects the ground pad to the shielding film, protecting the module from external electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an image sensor chip with semiconductor devices is used in a digital device, then high resolution imaging capability is achieved, but the device becomes susceptible to electromagnetic interference
Solution Approach 1:
The patent applies the principle of converting harm into benefit by using the ground pad, originally just a electrical connection element, as an active component in the electromagnetic shielding system. The ground pad is electrically connected to the shielding film through a conductor, transforming it into a reference potential that actively neutralizes electromagnetic interference, thereby protecting the high-resolution image sensor while maintaining its imaging capability
Solution Approach 2:
The patent introduces an electromagnetic shielding film as an intermediary element between the image sensor chip and the external environment. This shielding film, connected to the ground pad through a conductor, acts as a mediator that blocks electromagnetic interference from reaching the sensitive semiconductor devices, allowing the image sensor to maintain high resolution performance without susceptibility to EMI
2Device complexity
If a ground pad is disposed on the first surface of the substrate facing the housing interior, then the grounding structure is simplified, but the ground pad must be electrically connected to the shielding film through a conductor extending through the housing
Solution Approach 1:
The patent resolves the manufacturing complexity by transitioning the conductor connection from a planar arrangement to a three-dimensional configuration. The conductor extends through the housing in the vertical dimension, connecting the ground pad on the first surface to the shielding film, thereby simplifying the overall grounding structure while accommodating the spatial constraints of the housing interior
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields the camera module from electromagnetic interference, allowing for reliable operation while providing a simpler grounding structure for the image sensor chip, thus enhancing the module's performance and manufacturing efficiency.
Implementation Method 1
an electromagnetic wave-shielding film united with the housing
Implementation Method 2
an electrical conductor extending through a side of the housing electrically connects the ground pad and the electromagnetic wave-shielding film
Data Source
AI summary
A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.