Camera Module Heat Dissipating Structure for TOF Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high power consumption of TOF cameras in mobile electronic devices, combined with the presence of 5G antennas, leads to increased heat generation, which can be exacerbated by the proximity of these components, posing a challenge for effective heat dissipation in limited spaces.
Innovation Solution
A camera module with an integrated heat dissipating structure that includes a camera bracket, heat dissipating sheet, and heat conductive tape to efficiently transfer and dissipate heat generated from the camera PCB to the housing's metal portion, utilizing a graphite sheet for enhanced heat transfer and a flexible metal pattern sheet for reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If TOF camera and control circuitry are disposed adjacent to each other in limited space, then device integration is improved, but heat generation increases
Solution Approach 1:
The patent divides the camera module into separate functional components: light emitting unit, light receiving unit, and control circuitry, each disposed on different regions of the PCB. This segmentation allows better heat distribution and reduces concentrated heat generation while maintaining functional integration.
Solution Approach 2:
The patent introduces a heat dissipating structure as an intermediary between the heat-generating components (TOF camera and control circuitry) and the device housing. This intermediary structure facilitates heat transfer from the components to the housing, preventing heat accumulation in the limited space.
2Area of stationary object
If 5G antenna is disposed adjacent to TOF camera, then device space utilization is improved, but heat generation is intensified
Solution Approach 1:
The patent combines the heat dissipating function with the existing device housing structure, merging the housing into a dual-purpose component that both encloses the device and serves as a heat dissipation pathway. This eliminates the need for separate heat dissipation components, preserving space for the 5G antenna while managing heat from both the antenna and TOF camera.
3Temperature
If heat dissipating structure is added to camera module, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipating structure is designed to serve multiple functions: it acts as a thermal pathway from the camera module to the housing, provides structural support for the camera components, and integrates with the existing device architecture. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat generation on the surface of the electronic device, allowing for stable long-term operation of the TOF camera by rapidly diffusing heat across the device's surface, thereby addressing the heat management issues in compact mobile devices.
Implementation Method 1
a heat dissipating structure that transfers heat generated from the camera module to the metal portion of the housing
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing