Parallel Heat Sink for Camera Module PCBs
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Solution Overview
Problem
Existing methods for heat sinking in electronic devices, such as camera modules, face challenges due to the difficulty in fitting heat sinks or conductive materials in devices with multiple printed circuit boards, particularly when space is limited or PCBs are oriented perpendicularly, leading to inefficient heat dissipation.
Innovation Solution
The method involves arranging heating conductors and heat conductive pads in a parallel orientation within the camera module housing to dissipate heat from printed circuit boards and components, using materials like aluminum, aluminum alloys, or copper, with pads placed on both sides of the conductor to enhance heat transfer and fill air gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks or conductive materials are used in devices with multiple PCBs, then heat dissipation is achieved, but the device complexity and difficulty of fitting increase due to limited space and perpendicular PCB orientations
Solution Approach 1:
The patent combines multiple heat conductive pads into a single integrated heat sink structure that serves multiple PCBs simultaneously. The heat sink integrates heat conductive pads positioned against each PCB and a central heat dissipation body, merging what would traditionally be separate heat sinking components for each PCB into one unified structure, thereby reducing device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The patent transitions from planar heat sinking approaches to a three-dimensional structure where heat conductive pads are positioned at different heights and orientations to contact multiple PCBs. The heat sink extends in multiple dimensions with pads arranged to match the spatial distribution of heat-generating components across perpendicular PCBs, enabling effective heat transfer without increasing overall device footprint.
2Temperature
If heat conductive pads are placed outside the electronic device, then heat transfer is improved, but the device volume and integration are compromised
Solution Approach 1:
The patent nests the heat sink structure within the existing device housing and PCB assembly. The heat conductive pads are positioned between the PCBs and the heat dissipation body, effectively nesting the heat sinking function within the existing device volume rather than adding external components. This allows the heat sink to be integrated into the device's internal space without increasing overall device volume.
3Temperature
If multiple separate heat sinking solutions are provided for each PCB, then heat dissipation for each component is optimized, but the manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent combines multiple heat sinking functions into a single integrated heat sink structure that can be manufactured as one piece or pre-assembled unit. The heat conductive pads and heat dissipation body form a unified component that addresses the heat dissipation needs of multiple PCBs simultaneously, reducing the number of separate parts that need to be manufactured, inventoried, and assembled compared to providing individual heat sinks for each PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from multiple PCBs and components, improving the overall heat management in camera modules by conducting heat away from the components and into the heat sink, thereby enhancing the thermal performance and compliance with regulatory requirements for automotive applications.
Implementation Method 1
The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink
Data Source
AI summary
A method and apparatus for heat sinking a camera module, which may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras, is described herein. Heating conductors and heat conductive pads may be arranged in a parallel orientation within the housing of the camera module to dissipate heat produced by the printed circuit boards (PCBs) and other components within. The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink, which may be a heat conducting material including but not limited to aluminum, aluminum alloys, or copper. The heating pads may also fill the air gaps within the housing of the camera module.