Array Camera Module Height Difference Base Alignment
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Solution Overview
Problem
Dual camera modules face challenges in stabilizing and compactly integrating cameras of different sizes and heights, ensuring consistent light incident surfaces and optical axes, while also meeting varying hardware requirements for depth of field and image fusion functions.
Innovation Solution
An array camera module with a circuit board assembly where camera units are stably connected through a base with a height difference, ensuring consistent outer end faces and optical axes, and utilizing integral molding for precise alignment and flat installation, allowing for different camera configurations such as moving-focus and fixed-focus combinations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two cameras of different sizes are assembled into a dual camera module, then the functional requirements for different camera types are met, but the assembly stability and compactness are compromised
Solution Approach 1:
The base introduces a height dimension difference to accommodate cameras of different sizes. By creating a stepped structure where one camera is positioned at a different height level than the other, the design enables accommodation of different camera types while maintaining overall assembly stability and compactness.
Solution Approach 2:
The base features localized height differences at specific positions rather than uniform structure. This allows each camera to be positioned at its optimal height level according to its specific size requirements, while the rest of the assembly maintains compact integration.
2Measurement precision
If cameras are positioned to achieve consistent light incident surfaces, then imaging accuracy is improved, but the structural complexity increases
Solution Approach 1:
Instead of using complex lateral positioning mechanisms, the design achieves consistent light incident surfaces by utilizing the height dimension. The base creates vertical offsets that align the optical axes and light incident surfaces of different cameras, simplifying the overall structure while maintaining imaging accuracy.
3Measurement precision
If the distance between cameras is increased for depth of field function, then depth of field precision is improved, but the module size increases
Solution Approach 1:
The base enables increased camera spacing in the horizontal direction by providing vertical support at different heights. This allows the cameras to be positioned farther apart for improved depth of field precision while the vertical dimension accommodates the increased spacing without significantly increasing the overall module footprint.
Data Source
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AI summary
An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.