Camera Module Holder Circuit Pattern Layer Integration

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Solution Overview

Problem

The existing camera module designs require a separate connection substrate for actuator control, leading to manufacturing complexities and increased module size due to the need for additional wiring, which complicates stock management and increases the overall volume of the camera module.

Innovation Solution

The camera module integrates an electronic circuit pattern layer directly onto the holder of the camera module, eliminating the need for a separate PCB by forming the circuit on the surface of injection-molded components, allowing for connection between the actuator and PCB through this pattern layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate connection substrate is provided between the actuator and PCB, then the actuator can be conductively connected to the PCB, but the manufacturing complexity increases and stock management becomes difficult

Engineering Contradiction:

Improveconductive connection reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the connection substrate function with the holder by forming an electronic circuit pattern layer directly on the holder surface. This integration eliminates the separate connection substrate, reducing manufacturing complexity and stock management burden while maintaining reliable conductive connections between the actuator and PCB through the integrated circuit pattern layer

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If a separate connection substrate is provided, then the actuator can be connected to the PCB, but the camera module size increases due to the additional wiring volume

Engineering Contradiction:

Improveconnection reliabilityVSAvoidcamera module volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The connection substrate is merged with the holder structure, and the circuit wiring is formed as a pattern layer on the holder surface. This integration eliminates the need for separate wiring volume, thereby reducing the overall camera module size while preserving reliable electrical connections between components

Inventive Principle:

Principle #5Merging (Combining)

3Device complexity

If an electronic circuit pattern layer is formed on the holder, then the separate PCB can be eliminated, but additional manufacturing steps are required

Engineering Contradiction:

Improvestructure simplificationVSAvoidmanufacturing process complexity

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The electronic circuit pattern layer is formed on the holder during the injection molding process itself, rather than as a separate post-processing step. This preliminary action integrates circuit formation into the primary manufacturing process, eliminating the need for separate PCB assembly while avoiding additional complex manufacturing steps

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9270873B2Camera module including conductive layer corresponding to shape of electronic circuit pattern layer

Publication Date: 2016.02.23 LG INNOTEK CO LTD

AI summary

The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) formed with an image sensor, a holder formed at an upper surface of the PCB and mounted therein with at least one or more lenses, an actuator positioned at the holder, and an electronic circuit pattern layer formed on the holder.