Camera Module with Hollow Circuit Board for Height Reduction
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Solution Overview
Problem
Conventional camera modules face challenges in reducing their overall height due to the thickness required for accommodating the image chip and supporting components, making it difficult to achieve a compact design while maintaining functionality.
Innovation Solution
The camera module design incorporates a circuit board with a hollow portion that shelters a base plate, allowing the image chip to be positioned at the same level as the circuit board, reducing the overall height, and uses various materials for the base plate such as glass, ceramic, or metallic plates for structural reinforcement, with electrical connection via wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the base plate has a recess to accommodate the image chip, then the image chip can be properly supported and positioned, but the overall height of the camera module increases
Solution Approach 1:
The image chip is nested within the hollow portion of the circuit board, with the base plate covering the hollow portion from below. This nesting arrangement allows the image chip to be accommodated within the circuit board's thickness rather than adding external height, resolving the contradiction between supporting the image chip and maintaining compact overall height.
Solution Approach 2:
The circuit board transitions from a solid flat structure to a hollow structure with a cavity. By creating this three-dimensional hollow portion within the circuit board's thickness, the design provides accommodation space for the image chip without increasing the external dimensions, particularly the overall height of the camera module.
2Strength
If the circuit board and holder have their own thickness, then structural integrity is maintained, but the overall height cannot be reduced further
Solution Approach 1:
The base plate is integrated with the circuit board structure, covering the hollow portion and providing support for the image chip. This merging of the base plate function into the circuit board eliminates the need for a separate thick base plate, reducing overall height while maintaining structural integrity through the combined structure.
Solution Approach 2:
The circuit board serves multiple functions: it provides the structural platform, contains the hollow portion for image chip accommodation, and supports the base plate. This multi-functionality reduces the need for additional separate components that would increase overall height, while maintaining necessary structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively lowers the overall height of the camera module while maintaining the necessary functionality, enabling smaller and more portable electronic devices with image-capturing capabilities.
Implementation Method 1
The image chip is electrically connected with the circuit board by a wire bonding process
Data Source
AI summary
A camera module and an assembling method thereof are provided. The camera module includes a circuit board, a base plate, an image chip, a holder and a lens assembly. The circuit board includes a first surface, a second surface and a hollow portion running through the first surface and the second surface. The base plate is fixed on the second surface of the circuit board such that the hollow portion of the circuit board is sheltered by the base plate. The image chip is disposed on the base plate and accommodated within the hollow portion. The holder is fixed on the first surface of the circuit board. The lens assembly is fixed on the holder.