Camera Module Housing SMT Mounting for Optical Alignment
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Solution Overview
Problem
Conventional camera modules face issues with coupling defects between the housing and printed circuit board due to epoxy spread, leading to picture quality deterioration, tilt of the housing, and contamination of the image sensor, resulting in decreased assembly yield and inferior image quality.
Innovation Solution
A camera module is designed using a surface mount technology (SMT) with a metal bonding method to fix the housing to the printed circuit board, preventing light leakage and ensuring proper alignment of the optical axis, thereby improving assembleability and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy is spread to fix the housing to the printed circuit board, then the housing is fixed to the PCB, but light leakage occurs and picture quality deteriorates
Solution Approach 1:
The patent divides the fixing function into two separate components: epoxy for bonding and a separate sealing structure (housing extension or seal ring) for light blocking. This segmentation allows each component to perform its specialized function without compromise.
Solution Approach 2:
The patent introduces an intermediary sealing structure between the housing and PCB that specifically addresses light leakage without interfering with the epoxy bonding function. This intermediary element mediates between the conflicting requirements of strong fixation and light sealing.
2Reliability
If epoxy is excessively spread to ensure complete coverage, then fixation is improved, but the epoxy contaminates the image sensor and causes fixing defectiveness
Solution Approach 1:
The patent extracts the sealing function from the epoxy material and assigns it to a dedicated sealing structure. This extraction prevents epoxy from needing to be excessively spread, thereby eliminating contamination risk while maintaining fixation reliability.
Solution Approach 2:
The patent employs a seal ring or housing extension that acts as a flexible or rigid barrier to contain epoxy within appropriate boundaries while blocking light paths. This thin film or shell structure prevents contamination without compromising fixation.
3Stability of the object's composition
If epoxy viscosity varies, then the housing becomes tilted, but increasing epoxy amount to ensure coverage worsens the tilt and causes focus shift
Solution Approach 1:
The patent separates the stabilization function from the bonding function by introducing a dedicated sealing structure that provides mechanical support and positioning. This segmentation allows the housing to be stabilized without relying on epoxy viscosity control, preventing tilt and focus shift.
Solution Approach 2:
The patent implements preliminary positioning features such as protrusions fitting into recesses or pre-formed sealing structures that establish correct housing orientation before epoxy application. This preliminary action prevents tilt regardless of epoxy viscosity variations.
4Ease of manufacture
If conventional epoxy spreading method is used, then assembly is simple, but assembly yield decreases due to multiple defects
Solution Approach 1:
The patent incorporates sealing structures and positioning features into the housing or PCB during manufacturing, before final assembly. This preliminary action eliminates the need for complex epoxy application control during assembly, maintaining simplicity while improving yield by preventing defects.
Solution Approach 2:
The patent designs the housing or PCB with self-aligning and self-sealing features that automatically ensure correct positioning and light blocking without requiring precise epoxy application. This self-service mechanism maintains assembly simplicity while dramatically improving yield by eliminating human error in epoxy spreading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively seals the image sensor from stray light, maintains the optical axis alignment, and reduces contamination, enhancing the assembly accuracy and image quality while increasing the yield of the camera module manufacturing process.
Implementation Method 1
a second bonding portion (140) to which the solder is bonded
Data Source
AI summary
Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.