Camera Module Insulating Member Prevents Molding Material Damage
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Solution Overview
Problem
Conventional camera modules are bulky due to the need for safety distances between components, which hinders their integration into thinner and lighter electronic devices, and are prone to microlens damage and imaging quality issues during the MOC packaging process.
Innovation Solution
A camera module design incorporating an insulating member around the photosensitive area to prevent the molding material from reaching the sensitive areas, combined with an integral encapsulating support structure that encases the circuit board and non-photosensitive area, ensuring the microlenses are protected and the module's integrity is maintained.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If safety distances are reserved between components in conventional camera modules, then component reliability is improved, but the overall module size increases
Solution Approach 1:
The patent merges the frame and support structure into a single integral support structure that simultaneously provides mechanical support and defines component mounting positions. This integration eliminates the need for separate safety distance structures, allowing components to be positioned closer together while maintaining reliability through the unified structural design.
Solution Approach 2:
The patent introduces a molding material as an intermediary substance that fills the spaces between components and the integral support structure. This molding material provides mechanical support and electrical insulation, enabling components to be placed closer together while maintaining reliability without requiring additional safety distance structures.
2Volume of moving object
If MOC packaging technique is used to reduce module size, then module compactness is improved, but microlens damage risk increases
Solution Approach 1:
The patent applies a protective coating to the microlenses before the molding process. This preliminary protective layer prevents the molding material from directly contacting and damaging the microlenses during the high-pressure packaging process, while still allowing the molding material to fill the mold cavity and provide structural support.
Solution Approach 2:
The patent designs the mold cavity with precise clearances and uses a compliant protective coating on the microlenses to cushion against the molding material during the packaging process. This beforehand cushioning prevents direct mechanical contact between the rigid molding material and the fragile microlenses, eliminating damage risk while maintaining the compact MOC packaging benefits.
3Strength
If molding material is applied under high pressure to form integral structure, then structural strength is improved, but burr formation on microlenses increases
Solution Approach 1:
The patent applies a protective coating to the microlenses before the high-pressure molding process. This preliminary protective layer prevents the molding material from directly contacting and forming burrs on the microlens surfaces, while still allowing the high-pressure molding to proceed to achieve the desired structural strength of the integral support structure.
Solution Approach 2:
The patent uses a protective coating as an intermediary layer between the high-pressure molding material and the microlens surfaces. This intermediary layer allows the molding material to exert high pressure to form the integral structure with adequate strength while preventing direct contact that would cause burr formation on the precision microlens surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the camera module's size, enhances its strength, and improves imaging quality by preventing microlens damage and burr formation, thus addressing the challenges of size and reliability in conventional modules.
Implementation Method 1
the insulating member is provided to prevent the forming material of the integral encapsulating support structure, before it is solidified, from flowing to the photosensitive area of the photosensitive sensor
Implementation Method 2
the integral encapsulating support structure is formed to enclose, case and/or wrap up a non-photosensitive area of the photosensitive sensor, the circuit board and the bonding wires therebetween
Data Source
AI summary
A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.