Integrated Camera Module Packaging for Height Reduction

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Solution Overview

Problem

Conventional camera modules face challenges with optical axis uniformity, space minimization, contamination of resistor-capacitor components, and increased height due to adhesive-based assembly processes, which hinder the development of lighter, thinner, and more efficient camera modules.

Innovation Solution

A molded camera module design where the photosensitive element and window circuit board are integrally packaged by a packaging body, reducing relative height, improving heat dissipation, and shielding the photosensitive element from contaminants, while maintaining a stable mounting condition for optical components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the photosensitive chip is attached on the circuit board using adhesive bonding, then the photosensitive chip can be electrically connected and mechanically supported, but the flatness requirement increases and the overall height of the camera module increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidcamera module height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent combines the photosensitive chip, circuit board, and support structure into an integrated package body. The chip is embedded within the package body that directly contacts the circuit board, eliminating the need for separate adhesive layers and intermediate mounting structures, thereby reducing overall height while maintaining electrical connection reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The photosensitive chip is nested within the package body, which itself is nested on the circuit board. This nested structure allows the chip to be positioned close to the circuit board without requiring additional mounting height, effectively reducing the camera module's overall height while maintaining stable electrical connections.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of operation

If the base is fixed to the circuit board with adhesive and components are mounted on the base, then the components can be positioned and supported, but the flatness requirement increases and space is occupied by gold wires and resistor-capacitor components

Engineering Contradiction:

Improvecomponent positioning and supportVSAvoidspace occupation on circuit board

Core Design Contradiction:

Ease of operationVSArea of stationary object

Solution Approach 1:

The patent merges the base function with the package body. The package body serves both as the protective enclosure for the photosensitive chip and as the mounting base for other components. This integration eliminates the need for a separate adhesive-fixed base, reducing the area occupied on the circuit board while maintaining component positioning and support capabilities.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If resistor-capacitor components are protruded from the circuit board for electrical connection, then electrical connectivity is achieved, but the components are exposed to dust and debris causing contamination and black spots

Engineering Contradiction:

Improveelectrical connectivityVSAvoidcontamination from dust and debris

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The resistor-capacitor components are nested within the package body rather than protruding from the circuit board. This nested configuration protects the components from dust and debris exposure while maintaining their electrical connectivity functions through the package body's structural design.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The package body creates a protected environment (inert atmosphere) around the photosensitive chip and associated components. This enclosed space shields the components from harmful external factors such as dust and debris, preventing contamination and black spots while maintaining electrical connectivity.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

4Strength

If the photosensitive chip has significant thickness for attachment and protrusion, then mechanical support and electrical connection are ensured, but the camera module size increases and miniaturization becomes difficult

Engineering Contradiction:

Improvemechanical support capabilityVSAvoidcamera module size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent merges the mechanical support function with the package body structure. The package body provides the necessary mechanical support and structural integrity without requiring the photosensitive chip to have excessive thickness for attachment and protrusion, enabling camera module miniaturization while maintaining strength.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11223751B2Photosensitive assembly and camera module and manufacturing method thereof

Publication Date: 2022.01.11 NINGBO SUNNY OPOTECH CO LTD

AI summary

A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.