Camera Module Mechanical Bonding via Interlocking Connection Portions
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Solution Overview
Problem
Conventional camera module fabrication methods face challenges in miniaturization due to separate component fabrication, leading to increased costs and yield loss from particle contamination, and thermal deformation of polymer lenses, as well as mechanical cutting issues causing chipping and cracks during the dicing process.
Innovation Solution
A method involving mechanically combining a lens structure with a substrate using upper and lower connection portions, where the lens structure is adhered to the substrate without a thermal bonding process, minimizing thermal damage and avoiding chipping or cracking by using a mechanical insertion method and a dicing process that excludes the connection portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thermal bonding process is used to bond the lens structure to the substrate, then strong bonding is achieved, but the polymer lens deforms due to high temperature
Solution Approach 1:
The patent replaces the thermal bonding process with a mechanical bonding process. The lens structure includes connection portions that are inserted into corresponding connection portions in the substrate, achieving bonding through mechanical insertion rather than thermal processes. This eliminates the high temperature exposure that causes polymer lens deformation while still providing strong bonding between components.
2Ease of manufacture
If separate components are fabricated and then assembled, then component fabrication is simplified, but miniaturization becomes difficult and fabrication costs increase
Solution Approach 1:
The patent merges multiple components into an integrated structure. The lens structure, substrate, and connection portions are formed as an integrated unit using a unified fabrication process, eliminating the need for separate component fabrication and assembly. This integration enables miniaturization of the camera module while simplifying the overall manufacturing process.
3Ease of operation
If the image sensor chip is assembled while exposed to atmosphere, then assembly is straightforward, but particle contamination from the atmosphere causes yield drop
Solution Approach 1:
The patent performs preliminary actions to prevent contamination before assembly. The connection portions are formed with precise dimensions and tolerances during the fabrication process, enabling mechanical bonding without requiring atmospheric exposure during assembly. This preliminary precision fabrication eliminates the need for cleanroom conditions while maintaining high yield rates.
4Productivity
If mechanical cutting is used in the dicing process, then separation of components is achieved, but chipping and cracks occur due to high hardness of materials
Solution Approach 1:
The patent performs preliminary actions to prevent damage during dicing. The connection portions are designed with specific geometric features and are positioned to avoid the dicing paths. The dicing process is planned to cut between connection portions rather than through them, preventing chipping and cracks while maintaining dicing efficiency.
Data Source
AI summary
Provided are a camera module and a method of fabricating the same. The method includes preparing a lens structure including upper connection portions. Lower connection portions are formed in a predetermined region of a substrate. The lower connection portions define a chip region and fit in the upper connection portions, respectively. An image sensor chip is located on the bottom surface of the chip region. The lens structure is adhered to the substrate using the upper and lower connection portions.