Camera Module Substrate Layout to Isolate ISP Noise
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Solution Overview
Problem
Digital noise generated by the image signal processing chip (ISP) affects the CMOS image sensor when implemented on a single chip using the same substrate, complicating the interface and increasing manufacturing costs and power consumption.
Innovation Solution
The image sensor and image signal processing chip are mounted on opposite sides of a main substrate, with the signal processing chip received through a receiving hole in a first substrate, simplifying the interface and eliminating the need for a separate substrate, allowing for a smaller and more reliable camera module design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the image sensor and image signal processing chip are implemented on a single chip using the same substrate, then integration is achieved, but digital noise generated by the ISP affects the CMOS image sensor
Solution Approach 1:
The patent divides the imaging system into separate physical modules: the CMOS image sensor chip and the image signal processing chip are mounted on opposite sides of a main substrate, physically segmenting the system to prevent digital noise from the ISP from affecting the image sensor while maintaining functional integration
2Device complexity
If the image sensor and image signal processing chip are implemented on a single chip using the same substrate, then integration is achieved, but the interface becomes complicated and manufacturing costs increase
Solution Approach 1:
The patent introduces a main substrate as an intermediary carrier that hosts both the image sensor chip and the image signal processing chip on opposite sides. This intermediary structure simplifies the interface between components and reduces manufacturing complexity compared to integrating everything on a single chip
3Device complexity
If the image sensor and image signal processing chip are implemented on a single chip using the same substrate, then integration is achieved, but power consumption increases
Solution Approach 1:
By segmenting the system into separate chips mounted on opposite sides of the main substrate, the patent enables independent power management and optimization for each component, reducing overall power consumption compared to a monolithic integrated design where all components share the same power distribution network
Data Source
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AI summary
An image sensor module disclosed in an embodiment includes an image sensor; an image signal processing chip that interfaces with the image sensor; a main substrate having one surface on which the image sensor is mounted and the other surface on which the image signal processing chip is mounted; an adhesive member between the main substrate and the image sensor; and a first substrate bonded to the other surface of the main substrate, wherein the first substrate includes a receiving hole extending from the other surface to the one surface, and the image signal processing chip may be connected to the other surface of the main substrate through the receiving hole of the first substrate.