Compact Camera Module Lateral Contact Rework
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Solution Overview
Problem
The size of compact camera modules cannot be minimized due to the need for space reserved for bonding wires connecting the substrate and image sensor chip, and the removal of defective modules can damage the components, increasing manufacturing costs.
Innovation Solution
A compact camera module design featuring an image sensor chip with lateral contacting fingers and a module case with electrically contact components, replacing bonding wires to reduce substrate surface waste and enable efficient reworking, with external guides for improved connections to external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If bonding wires are used to connect the substrate and image sensor chip, then electrical connection is achieved, but the size of the camera module cannot be minimized due to space required for wiring
Solution Approach 1:
The patent extracts and removes the bonding wires from the connection structure between the image sensor chip and substrate. Instead of using traditional bonding wires that extend from the chip to the substrate surface, the invention integrates electrical contact components directly into the module case, eliminating the need for bonding wires and freeing up substrate surface space.
Solution Approach 2:
The patent transitions from a two-dimensional wiring approach (bonding wires on the substrate surface) to a three-dimensional integration approach where electrical contact components are embedded within the module case structure. This allows electrical connections to be established through vertical integration rather than horizontal routing, reducing the footprint on the substrate surface.
2Reliability
If the CCM is tested after fabrication is complete, then defects can be detected, but the bonding wires and image sensor chip must be removed which causes damage and increases manufacturing cost
Solution Approach 1:
The patent segments the image sensor chip assembly from the substrate by using removable electrical contact components in the module case. This segmentation allows the image sensor chip to be easily detached from the substrate for rework or replacement without damaging the substrate or requiring removal of bonding wires, thereby improving reworking efficiency while maintaining the ability to test for defects.
Solution Approach 2:
The invention enables easy discarding and recovery of the image sensor chip and electrical contact components during testing and rework processes. The modular design allows defective components to be removed and replaced without damaging the substrate, effectively recovering the substrate for continued use and reducing manufacturing costs.
Data Source
AI summary
A compact camera module mainly includes an image sensor chip, a module case and a lens module. The image sensor chip has an active surface, a back surface and a plurality of side surfaces, wherein a sensor region is formed in the active surface. A plurality of lateral contact fingers is formed on the side surfaces. The image sensor chip is plugged in a cave of the module case, a plurality of electrically contact components disposed on inside walls of the cave electrically connect the lateral contacting fingers. The lens module is mounted on the module case to seal the image sensor chip. Because the electrically contact components can replace the bonding wires to electrically connect the lateral contacting fingers, the compact camera module can be reworked and tiny.