Camera Module Lens Barrel Adhesion via Substrate Segmentation
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Solution Overview
Problem
Conventional digital still camera modules face challenges in ensuring secure adhesion of the lens module to the image sensor package, leading to potential moisture infiltration and electrical connectivity issues due to inadequate or excessive adhesive application, and alignment problems that result in image distortion and reduced quality.
Innovation Solution
A digital still camera module design featuring an image sensor package with a substrate and a transparent cover, where the lens barrel is securely attached to an uncovered section of the substrate, using a ceramic or fibrous composite material substrate with strategically placed solder pads and vias for precise electrical connections, and applying adhesive in a controlled manner to prevent overflow and ensure alignment of the lens with the image sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive means is applied between the lens module and the substrate to secure attachment, then the lens module adheres securely to the substrate, but it is difficult to control the amount of adhesive, leading to either insufficient adhesion or overflow that causes electrical connectivity issues
Solution Approach 1:
The patent applies adhesive beforehand to a specific region (the first surface of the substrate) before mounting the lens module. This preliminary application allows precise control of adhesive quantity and location, preventing both insufficient adhesion and overflow onto electrical leads, thereby resolving the contradiction between achieving strong adhesion and maintaining manufacturing precision.
2Reliability
If the lens module is mounted onto the substrate to cover the image sensor package, then the image sensor is protected, but the lens may become misaligned with the image sensor chip, causing image distortion and reduced quality
Solution Approach 1:
The patent divides the substrate into distinct functional regions: a first surface for adhesive application and lens mounting, and a second surface with electrical leads for connectivity. This segmentation allows independent optimization of lens alignment on the first surface while protecting the electrical connections on the second surface, resolving the contradiction between sensor protection and alignment precision.
3Strength
If excess adhesive means is applied to ensure secure attachment, then the lens module adheres strongly to the substrate, but the adhesive overflows and forms insulating coatings on the electrical leads, causing connectivity failure
Solution Approach 1:
The patent applies adhesive to a specific local region (the first surface of the substrate) rather than uniformly across the entire substrate. This localized application ensures sufficient adhesion strength at the lens-substrate interface while preventing adhesive overflow onto the electrical leads located on the second surface, thereby maintaining both strong adhesion and reliable electrical connectivity.
Data Source
AI summary
A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.