Compact Camera Module Lens Holder Integration
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Solution Overview
Problem
The existing camera modules in portable electronic devices face challenges in being both compact and cost-effective due to the difficulty in manufacturing thin lens holders using injection molding, which increases production costs.
Innovation Solution
The camera module design includes a lens module with a lens barrel and holder, where the image sensor chip is directly fixed to the lens holder, and a transparent adhesive layer is used to create a package structure, allowing for a more robust and easily manufacturable design that reduces the need for precise placement of electronic elements and minimizes space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the lens holder is made thin to minimize the size of the camera module, then the compactness is improved, but the manufacturing difficulty increases and cost rises
Solution Approach 1:
The lens holder and lens barrel are merged into a single integrated component. The lens holder includes a receiving cavity that receives the lens barrel, eliminating the need for separate thin lens holder structures that are difficult to manufacture. This integration maintains compactness while simplifying the manufacturing process.
Solution Approach 2:
The camera module is divided into distinct functional modules: the lens module (lens barrel with lens), the image sensor chip module, and the printed circuit board module. Each module can be manufactured separately using appropriate methods and then assembled, allowing the lens holder to be designed with optimal structural features for manufacturing rather than being constrained by overall compactness requirements.
2Volume of moving object
If the lens holder is made thin to reduce camera module volume, then the compactness is improved, but the production cost increases
Solution Approach 1:
By merging the lens holder and lens barrel into one integrated component, the design eliminates the need for complex thin-walled structures that require precision injection molding. This integration reduces manufacturing complexity and cost while maintaining the compact form factor.
Solution Approach 2:
The patent employs standard injection molding techniques for manufacturing the integrated lens holder and lens barrel assembly, using conventional materials and processes rather than specialized expensive manufacturing methods. This approach makes the production cost economically suitable for mass-market portable electronic devices.
3Device complexity
If the image sensor chip is directly fixed to the lens holder, then the manufacturing complexity is reduced, but the structural robustness may be compromised
Solution Approach 1:
The image sensor chip is directly fixed to the lens holder, merging two components into a unified structure. This eliminates intermediate mounting steps and reduces overall assembly complexity. The direct fixation maintains structural robustness through the rigid connection between the chip and lens holder.
Solution Approach 2:
The image sensor chip is pre-fixed to the lens holder during lens holder manufacturing or as a preliminary assembly step. This preliminary action ensures proper positioning and structural integrity before final assembly with the printed circuit board, simplifying subsequent manufacturing steps while maintaining robustness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the production of compact and cost-effective camera modules by simplifying the manufacturing process and reducing the need for precise element placement, thereby lowering production costs while maintaining performance.
Implementation Method 1
a transparent adhesive layer is used to create a package structure
Data Source
AI summary
A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.