Camera Module Light Absorption Member for Flare Reduction
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Solution Overview
Problem
Advanced flip-chip mounting in camera modules leads to reduced image quality due to flare and ghost effects caused by unintended light entry from reflective surfaces, and existing light shielding solutions either narrow the effective pixel region or vary with positioning accuracy, hindering further downsizing and image quality improvement.
Innovation Solution
An electronic component with a circuit board, a translucent member, and a light absorption or shielding member is designed, where the light absorption member is formed between the circuit board and the translucent member on the circuit board's face, excluding the opening area, and the light shielding member is placed on the translucent member's outer peripheral end face, to minimize light interference and maintain pixel region consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light shielding member is formed on a glass face as a translucent protective member, then reflected light is restricted, but the effective pixel region varies per product depending on positioning accuracy
Solution Approach 1:
The patent transitions from forming the light shielding member on the glass face (translucent protective member) to forming it on the circuit board face. This dimensional change in the formation location eliminates positioning accuracy issues while maintaining the light shielding function, as the circuit board provides a more stable and accurate reference plane for formation processes.
2Volume of moving object
If the effective pixel region is minimized to advance downsizing, then camera module size is reduced, but the effective pixel region is needlessly narrowed in existing light shielding members
Solution Approach 1:
The patent applies local quality by forming the light shielding member with specific light-absorbing properties only in the necessary regions on the circuit board face, rather than uniformly narrowing the entire effective pixel region. This allows selective light shielding where needed while preserving the full effective pixel region for image capture, thus enabling downsizing without sacrificing imaging performance.
3Volume of moving object
If flip-chip mounting is advanced for downsizing, then chip size is reduced, but light from unintentional parts enters the light receiving face causing flare or ghost
Solution Approach 1:
The patent implements preliminary anti-action by forming the light shielding member on the circuit board face before light can enter unintentionally. This preventive measure blocks reflected light from wiring and other unintentional light sources at the source, preventing flare or ghost effects before they can occur in the flipped-mounted chip configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces flare and ghost effects, allowing for further downsizing of camera modules while maintaining image quality by minimizing light interference and ensuring consistent effective pixel regions.
Implementation Method 1
a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board
Implementation Method 2
a light shielding member formed at least on the outer peripheral end face of the translucent member
Data Source
AI summary
To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.