Camera Module Light Blocking Layer for Image Sensor Circuit Area
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Solution Overview
Problem
In camera modules for cellular phones, unnecessary light can adversely affect image quality by entering the image sensor chip, compromising the image quality.
Innovation Solution
A camera module design incorporating an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer, where the light blocking layer is positioned between the transparent substrate and the adhesive portion or the lens structure to prevent unnecessary light from entering the circuit area, using materials like metal or carbon-based organic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the image sensor chip is exposed to light from the lens structure, then the light receiving area can capture light for image formation, but unnecessary light enters the circuit area and adversely affects image quality
Solution Approach 1:
The image sensor chip is divided into distinct functional areas: a light receiving area that allows light to pass through for image capture, and a circuit area that is protected from light by the adhesive portion and light blocking layer. This segmentation enables each area to perform its specific function without interference from unnecessary light.
Solution Approach 2:
The harmful element (unnecessary light) is extracted from the system by introducing a light blocking layer and adhesive portion that selectively block light from reaching the circuit area while allowing light to reach the light receiving area. This extraction removes the adverse effect without compromising the light capture function.
Solution Approach 3:
Different regions of the image sensor chip are given different optical properties: the light receiving area is designed to be transparent to light for capturing images, while the circuit area is protected by opaque adhesive portions and light blocking layers. This local differentiation of optical properties ensures that each region performs its intended function optimally.
2Measurement precision
If a light blocking layer is added to block unnecessary light from the circuit area, then image quality is improved, but the device complexity increases
Solution Approach 1:
The light blocking function is merged with existing structural elements of the camera module. The adhesive portion that bonds the image sensor chip to the substrate also serves as a light blocking layer for the circuit area. Additionally, the light blocking layer is integrated with the lens structure, combining multiple functions into unified components rather than adding separate independent elements.
Solution Approach 2:
The adhesive portion and light blocking layer serve multiple functions: they provide structural support, enable bonding between components, block unnecessary light from the circuit area, and maintain the optical path for the light receiving area. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks unnecessary light, thereby enhancing image quality and ensuring high-quality images are obtained in the camera module.
Implementation Method 1
The light blocking layer is attached to the transparent substrate to block light from entering the circuit area
Implementation Method 2
The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing the light from the lens structure to enter the light receiving area
Implementation Method 3
The adhesive portion attaches the image sensor chip and the transparent substrate, and selectively covers the circuit area
Implementation Method 4
The photodiode generates charges corresponding to the intensity of the incident light, and then transfers the charges in the form of the electrical signal to the ISP
Data Source
AI summary
A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area.