Camera Module Metal Base for Thin Filter Mounting
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Solution Overview
Problem
Conventional camera modules face challenges in reducing the thickness of the filter mounting part and Flange Back Length (FBL) due to limitations in resin injection molding, which also affects the flatness and rigidity of the filter mounting part.
Innovation Solution
A camera module with a new base structure using an ultraviolet curable material directly bonded to the filter, eliminating the need for an injection-molded base and allowing for a thinner and more flexible filter mounting part, thereby reducing the FBL and enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the filter mounting part is manufactured by injection molding using resin, then it can be easily manufactured, but the thickness cannot be reduced below a certain level due to mold extractability and deformation issues
Solution Approach 1:
The patent changes the material parameter from resin to metal, enabling the filter mounting part to achieve thickness below 1mm while maintaining structural integrity and avoiding the extraction and deformation issues inherent to injection-molded resin parts
Solution Approach 2:
The patent employs a composite structure combining metal frame and resin injection, where the metal provides structural strength for thinness while the resin fills gaps and provides electrical insulation, achieving both thinness and manufacturability
2Length of stationary object
If the thickness of the filter mounting part is reduced, then the FBL can be reduced and miniaturization can be achieved, but the flatness and rigidity of the filter mounting part deteriorate
Solution Approach 1:
The patent changes the material parameter from resin to metal, which inherently provides higher rigidity and better flatness maintenance even at thicknesses below 1mm, thereby achieving thinness without sacrificing structural strength
Solution Approach 2:
The patent introduces a three-dimensional frame structure with protrusions and recesses that provide structural support in multiple dimensions, enabling the thin filter mounting part to maintain rigidity and flatness through spatial structural design rather than relying solely on material thickness
3Area of stationary object
If the size of the filter mounting part is increased to accommodate larger sensors and filters, then higher resolution can be achieved, but flatness and warpage problems occur in injection-molded parts
Solution Approach 1:
The patent changes the material parameter from resin to metal, which has superior dimensional stability and resistance to warpage, enabling the filter mounting part to maintain flatness even when scaled up to accommodate larger high-resolution sensors and filters
Solution Approach 2:
The patent divides the filter mounting part into a frame structure with separate regions for sensor mounting and filter mounting, allowing each segment to be optimized independently for flatness and reducing overall warpage through distributed structural support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, reduces the product unit price, improves design freedom, and enhances the operational reliability of the camera module by maintaining flatness and rigidity while minimizing thickness and FBL.
Implementation Method 1
a base (150) including a curable material cured on a lower surface of the filter (141). The base (150) may be integrated with the filter unit (140). Here, the integration may mean that there are no additional components between the base and the filter unit.
Data Source
AI summary
A camera module according to an embodiment includes a reinforcement plate; a circuit board disposed on the reinforcement plate and including a cavity; a sensor disposed in a region of an upper surface of the reinforcement plate overlapping the cavity of the circuit board in an optical axis direction; a base disposed on the circuit board; and a filter unit disposed on the base and overlapping the sensor on an optical axis, and wherein the base is a metal frame including a metal material.