Camera Module Power Signal Separation via Metal Columns
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Solution Overview
Problem
Heat generated by connectors in electronic devices can affect signal transmission and performance of camera modules, leading to inefficiencies in existing camera module designs.
Innovation Solution
The camera module is designed with separate power and signal transmission paths using metal columns for power and IC chips for signal processing, reducing heat conduction and allowing for easy replacement of the camera module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a connector is used to transmit both power and signals between the camera module and the main board, then the structure is simple and easy to manufacture, but heat generated by the connector affects signal transmission and camera module performance
Solution Approach 1:
The patent divides the transmission function into separate paths: power transmission through metal columns and signal transmission through IC chips. This segmentation separates the heat-generating power transmission from the sensitive signal transmission, eliminating heat interference while maintaining manufacturing simplicity through modular components.
Solution Approach 2:
The patent extracts the power transmission function from the connector and implements it through dedicated metal columns. This extraction removes the harmful heat generation from the signal transmission path, allowing the connector to focus solely on signal transmission without thermal interference.
2Device complexity
If a connector is used for both power and signal transmission, then the device structure is compact, but the camera module cannot be easily replaced
Solution Approach 1:
The patent segments the connection interface into separate power connection (metal columns) and signal connection (IC chips with connectors) components. This allows the camera module to be replaced by disconnecting the signal connector while leaving the power connection intact, enabling easy replacement without affecting the entire power transmission infrastructure.
Solution Approach 2:
The patent extracts the signal transmission function into a separable connector interface between the camera module and main board. This extracted connector allows the camera module to be easily disconnected and replaced, while the power transmission through metal columns remains as a stable, permanent connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes heat interference with signal transmission and facilitates easy replacement of the camera module, enhancing performance and convenience.
Implementation Method 1
at least three metal columns 30 are provided on the first surface 112 of the circuit board 11... power transmission is separated from the signal transmission between the camera module 10 and the attachment 50. Namely, power transmission between the camera module 10 and the attachment 50 is realized through the metal column 30
Implementation Method 2
signals transmission between the camera module 10 and the attachment 50 is realized through the first IC chip 20 and the second IC chip 70
Implementation Method 3
power transmission is separated from the signal transmission between the camera module 10 and the attachment 50... heat conduction and heat radiation between the camera module 10 and the attachment 50 is reduced
Implementation Method 4
at least three metal columns 30 and a fool-proofing column 40 are provided on the first surface 112 of the circuit board 11... The diameter of the first connecting section 302 is smaller than the diameter of the first fitting section 301 and of the diameter of the first fixing section 303
Data Source
AI summary
An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.