Camera Module Circuit Board Metal Member Flatness
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Solution Overview
Problem
Conventional camera modules face issues with flatness and heat dissipation due to the curvature of printed circuit boards when assembled, affecting the performance of image sensors and lens units during auto-focus and auto-zoom operations.
Innovation Solution
A camera module design featuring a circuit board with a metal member, insulation layer, and metal wire, where the metal member's thickness exceeds the combined thickness of the insulation layer and metal wire, ensuring flatness and improved heat dissipation, and a base with a metal substrate and conductive layers to reduce electromagnetic interference and enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a printed circuit board is used to support the image sensor, then the image sensor can be mounted and electrically connected, but the printed circuit board may curve during assembly or movement, reducing flatness
Solution Approach 1:
The patent changes the material parameter of the support structure from conventional printed circuit board material to metal material. This parameter change provides superior dimensional stability and flatness while resisting curvature during assembly and operation, directly resolving the technical contradiction between maintaining flatness and ease of manufacture.
Solution Approach 2:
The patent employs a composite structure consisting of a metal support structure with integrated circuit traces and insulation layers. This composite material approach combines the mechanical stability of metal with the electrical functionality of printed circuit boards, eliminating the curvature issue while maintaining manufacturability.
2Volume of moving object
If the circuit board is made thinner to reduce module size, then the camera module can be miniaturized, but heat dissipation capability is reduced
Solution Approach 1:
The patent changes the material parameter from conventional PCB material to metal material with superior thermal conductivity. This allows the support structure to be made thinner for miniaturization while maintaining effective heat dissipation capabilities, as metal materials can dissipate heat more efficiently even in thinner configurations.
Solution Approach 2:
The patent replaces the conventional PCB structure with a metal-based structure that integrates both mechanical support and thermal management functions. The metal material substitution provides enhanced heat dissipation through superior thermal conductivity, allowing thinner designs without compromising thermal performance.
3Object-affected harmful factors
If conventional PCB materials are used, then manufacturing is easier and cost is lower, but electromagnetic interference is not effectively reduced
Solution Approach 1:
The patent uses a composite structure with metal support, insulation layers, and conductive traces. This composite material approach inherently provides electromagnetic shielding properties that reduce electromagnetic interference, while the manufacturing process remains relatively simple through integrated fabrication techniques.
Solution Approach 2:
The patent introduces insulation layers as intermediary elements between conductive components. These insulation layers act as mediators that prevent electromagnetic coupling and interference between adjacent conductors, effectively reducing EMI while maintaining a manufacturable structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a miniaturized, flat camera module with improved heat dissipation and reduced electromagnetic interference, preventing inclination and enhancing the camera's ability to capture images and videos with stability and efficiency.
Implementation Method 1
the metal member, an insulation layer, and a metal wire... the thickness of the metal member exceeds the total thickness of the insulation layer and the metal wire
Implementation Method 2
The insulation layer is disposed between the metal member and the metal wire
Implementation Method 3
the metal wire is electrically connected to the image sensor
Data Source
AI summary
A camera module is provided, including a lens driving mechanism, a lens unit, a circuit board, and an image sensor. The lens unit is disposed on the lens driving mechanism. The image sensor is disposed on the circuit board. The circuit board includes a metal member, an insulation layer, and a metal wire. The insulation layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens driving module can drive the lens unit to move relative to the image sensor. The image sensor can catch the light through the lens unit.