Camera Module Thermal Management via Metal Plate

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Solution Overview

Problem

Existing electronic devices with camera modules face reliability issues due to inadequate thermal discharge, leading to heat-induced degradation of image quality and noise in captured images.

Innovation Solution

An electronic device design featuring a metal plate with a camera module, a metal flange that covers the sidewall, and a metal frame, where the image sensor is in thermal contact with the metal plate through an adhesive material, enhancing the thermal discharge path by increasing the contact area for effective heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the camera module is integrated into the electronic device, then the functionality and visibility are improved, but heat accumulation occurs leading to reliability degradation

Engineering Contradiction:

Improvecamera module integrationVSAvoidcamera module reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A metal plate is introduced as an intermediary thermal management component between the camera module and the electronic device housing. The metal plate provides a dedicated thermal conduction path that mediates heat transfer from the image sensor to the housing, preventing heat accumulation while maintaining the integrated camera module design.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces conventional thermal management approaches with a direct thermal conduction system using a metal plate and adhesive material combination. This mechanical thermal conduction system substitutes for less effective heat dissipation methods, providing reliable heat removal through controlled thermal pathways.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If thermal discharge path is enlarged, then heat dissipation is improved, but device structure becomes more complex

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal management structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal management system is segmented into distinct functional components: the metal plate for heat distribution, the adhesive material for thermal interface and attachment, and the housing for final heat dissipation. This segmentation allows each component to be optimized independently while maintaining overall system simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The metal plate serves multiple functions simultaneously: it acts as a thermal conduction path, a structural support element, and a mounting surface for the camera module. This multi-functionality reduces the need for additional dedicated thermal management components, thereby simplifying the overall device structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If adhesive material is used for thermal contact, then assembly is simplified, but thermal conduction efficiency may be reduced

Engineering Contradiction:

Improveassembly simplicityVSAvoidthermal conduction efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The adhesive material is selected and engineered with specific thermal conductivity parameters optimized for thermal conduction. By changing the material parameters of the adhesive (using thermally conductive adhesive formulations), the system achieves both ease of assembly and adequate thermal conduction efficiency, eliminating the traditional trade-off between these two requirements.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively discharges heat generated from the image sensor, improving the reliability of the camera module by reducing heat-induced noise and maintaining image quality.

Implementation Method 1

The image sensor may contact the metal plate through a second adhesive material... A lower portion of the metal flange and the second part of the metal plate may contact the first adhesive material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11706509B2Electronic device including camera module

Publication Date: 2023.07.18 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.