Camera Module Molded Enclosure Flexible Substrate Stabilization

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Solution Overview

Problem

Existing camera modules in mobile devices face challenges in achieving high-quality image stabilization while maintaining a compact form factor and low manufacturing costs, as conventional image stabilization components occupy significant space within the device.

Innovation Solution

The design incorporates a flexible substrate wrapped around a molded enclosure, encapsulating optical image stabilization components, which allows for a compact camera module with low manufacturing costs, utilizing voice coil motors or MEMS actuators for stabilization and a flexible high-density interconnect substrate for efficient interconnection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional image stabilization components are used, then image stabilization performance is improved, but device volume increases

Engineering Contradiction:
Improveimage stabilization performanceVSAvoiddevice volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent implements nesting by placing the image stabilization components (voice coil motor or MEMS actuator, lens, and image sensor) inside a molded enclosure that is then wrapped by a flexible substrate. This nested configuration allows the stabilization mechanism to be contained within a compact volume, resolving the contradiction between stabilization performance and device size.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from conventional planar camera module layouts to a three-dimensional configuration by wrapping the flexible substrate around the molded enclosure in a cylindrical or curved arrangement. This dimensional change enables more efficient space utilization and reduces the overall footprint while maintaining all necessary stabilization components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional camera module designs are used, then manufacturing reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvemanufacturing reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the camera module into distinct functional components: a molded enclosure containing the image stabilization mechanism, a flexible substrate providing structural support and electrical connections, and modular lens and sensor assemblies. This segmentation allows each component to be manufactured and tested independently using optimized processes, reducing overall manufacturing cost while maintaining reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs parameter changes by selecting specific materials and manufacturing processes: using injection molding for the enclosure to achieve high precision and consistency, selecting flexible substrates with appropriate mechanical and electrical properties, and choosing voice coil motors or MEMS actuators based on performance requirements. These parameter optimizations balance manufacturing cost with reliability.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If compact form factor is achieved, then device portability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The flexible substrate serves multiple functions simultaneously: it provides the structural framework for the compact cylindrical design, acts as a mounting platform for electronic components, provides electrical interconnections between components, and serves as a protective barrier. This multi-functionality reduces the number of separate parts needed, simplifying manufacturing despite the compact form factor.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent adopts a curved or cylindrical configuration by wrapping the flexible substrate around the molded enclosure. This curved geometry efficiently packs the image stabilization components in three-dimensional space, achieving compactness while the modular wrapped structure actually simplifies assembly compared to rigid complex geometries.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a compact, cost-effective, and reliable small form factor autofocus camera module that effectively stabilizes images, reducing the overall size and manufacturing costs while maintaining high performance.

Implementation Method 1

optical image stabilization, which utilizes gyro-sensors to detect the angular velocity of the camera. The lens or image sensor is moved in response to this detection, to stabilize the recorded image by varying the optical path to the image sensor

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

utilizing voice coil motors or MEMS actuators for stabilization

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS9204025B1Camera module with a molded enclosure contained in a flexible substrate
Publication Date: 2015.12.01 AMAZON TECH INC
  • US9204025B1 patent drawing
  • US9204025B1 patent drawing
  • US9204025B1 patent drawing

AI summary

Systems and methods of manufacturing compact camera modules for use in electronic device are provided. The camera module includes a lens housing and a substrate assembly. The substrate assembly includes a flexible substrate wrapped around a molded enclosure. The optical image stabilization components for the camera module may be enclosed within the molded enclosure.