Compact Camera Module with Nested Filter and Flip-Chip Sensor
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Solution Overview
Problem
There is a need to reduce the size of camera modules, particularly for use in small electronic devices such as smartphones and game consoles, without compromising their functionality.
Innovation Solution
The camera module design includes a substrate with a window, an image sensor flip-chip bonded to its lower surface, and a filter overlapped with the substrate and image sensor area, along with a flexible substrate and molding portions to minimize size and protect components, while maintaining optical alignment and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional camera module structures are used, then functionality is maintained, but product size cannot be reduced
Solution Approach 1:
The filter is positioned to overlap with the substrate in the direction perpendicular to the optical axis, and the image sensor is flip-chip bonded to the lower surface of the substrate. This nested arrangement allows components to occupy overlapping spatial volumes, reducing the overall camera module size while maintaining all functional components
Solution Approach 2:
The filter is disposed on the window and overlapped with the substrate in the direction perpendicular to the optical axis, utilizing the third dimension (depth) to arrange components. This dimensional reorganization reduces the footprint area while maintaining functionality, achieving compactness without sacrificing reliability
2Volume of moving object
If components are arranged compactly, then product size is reduced, but protection from foreign substances may be compromised
Solution Approach 1:
The first molding portion surrounds the lower surface of the substrate and the image sensor, while the second molding portion surrounds the upper surface of the substrate and the element. This nested molding structure provides protective encapsulation in a compact arrangement, preventing foreign substance contamination while maintaining reduced module size
Solution Approach 2:
A flexible substrate is coupled to the lower surface of the substrate, providing protection and flexibility. The molding portions act as protective shells that seal the internal components from foreign substances while allowing for compact component arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a compact camera module that reduces product size while maintaining image sensor functionality and protecting internal components from foreign substances, enhancing the module's reliability and efficiency.
Implementation Method 1
an image sensor disposed on the other side of the substrate and facing the lens through the hole... an upper surface of the image sensor comprises an image area for converting light incident through the lens into an electrical signal
Implementation Method 2
an adhesive material adhered to the filter is disposed in the image area of the image sensor
Data Source
AI summary
A camera module is provided. A camera module according to one aspect of the present invention comprises: a substrate comprising a window; an image sensor coupled to the lower surface of the substrate; and a filter coupled to the upper surface of the image sensor and arranged on the window.