Camera Module Thickness Reduction via Nested OIS Actuator
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Solution Overview
Problem
Conventional camera modules with Optical Image Stabilization (OIS) and Auto Focus (AF) actuators stacked on a Printed Circuit Board (PCB) increase the thickness of the device, hindering miniaturization efforts.
Innovation Solution
The camera module design incorporates an OIS actuator with openings to accommodate an image sensor directly on the board, reducing thickness by integrating the image sensor carrier within the OIS actuator, and using a Shape Memory Alloy (SMA) for actuator control, eliminating the need for separate soldering and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the AF actuator and OIS actuator are arranged in series in a stack on the PCB, then the camera module can provide both AF and OIS functions, but the thickness of the camera module is increased
Solution Approach 1:
The image sensor is nested within the OIS actuator structure by forming an opening in the OIS actuator that accommodates the image sensor. This eliminates the need for a separate image sensor carrier and reduces the overall stack height, allowing both AF and OIS functions to be integrated without increasing camera module thickness.
Solution Approach 2:
The functions of the image sensor carrier and OIS actuator are merged into a single integrated structure. The OIS actuator simultaneously serves as the mounting structure for the image sensor and provides the optical image stabilization function, reducing the number of separate components and decreasing overall thickness.
2Ease of manufacture
If the image sensor is mounted on a separate carrier board, then the image sensor can be easily replaced and manufactured, but the overall thickness and complexity of the camera module is increased
Solution Approach 1:
The image sensor mounting function is merged with the OIS actuator structure. The opening formed in the OIS actuator serves as both the mounting location and the structural element providing stabilization, eliminating the separate carrier board and reducing overall device complexity while maintaining manufacturing ease.
3Reliability
If conventional soldering methods are used to attach actuators to the PCB, then reliable electrical connections are achieved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The conventional soldering process is replaced with a mechanical attachment method using a protrusion-fit structure. The protrusion formed on the OIS actuator fits into a corresponding recess on the PCB, providing reliable mechanical and electrical connection without requiring soldering, thereby simplifying the manufacturing process and improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a slimmer, more compact camera module by reducing the overall thickness and simplifying the manufacturing process through reduced soldering steps and cost-effective actuator control.
Implementation Method 1
using a Shape Memory Alloy (SMA) for actuator control, eliminating the need for separate soldering and reducing manufacturing costs
Data Source
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AI summary
An electronic device includes a camera module, a board, and a first member fixed to the board. A second member is movably connected to the first member, and formed in at least a portion of the first member. A control member is connected to the first member and the second member so as to control the second member in response to a movement of the electronic device.