Vehicle Camera Module Overlap Welding for Optical Alignment
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Solution Overview
Problem
Existing camera modules for vehicles face challenges in efficiently attaching housing parts without damaging electronics components due to manufacturing tolerances, which can lead to misalignment and overpressure, and require complex assembly processes.
Innovation Solution
A method involving a housing assembly made of electrically conductive materials, particularly metal, with an electronics carrier sandwiched between housing parts using an interference fit and overlap welding, eliminating the need for screws and ensuring optical alignment through elastic mechanisms and laser welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are used to attach housing parts and electronics carrier, then mechanical strength and reliability are improved, but assembly complexity and time increase
Solution Approach 1:
The patent removes the screws (fastening elements) from the assembly system entirely. The housing parts are designed with integrated attachment features such as recesses and protrusions that enable direct mechanical coupling without separate fastening components, thereby eliminating assembly complexity while maintaining structural integrity
Solution Approach 2:
The attachment function is merged into the housing part geometry itself. The first and second housing parts include integrated attachment features (recesses, protrusions, or interference-fit structures) that combine the housing structure and fastening mechanism into a single integrated component, eliminating the need for separate screws
2Temperature
If housing parts are made of metal to improve heat dissipation, then thermal management is improved, but manufacturing cost and weight increase
Solution Approach 1:
The patent employs composite construction where metal components (for heat dissipation) are combined with plastic housing parts. The electronics carrier with metal heat-dissipating structures is integrated into the plastic housing assembly, allowing selective use of materials based on functional requirements rather than making the entire housing metal
Solution Approach 2:
Metal material is applied locally only where heat dissipation is critical (electronics carrier and adjacent housing regions), while other housing parts remain in plastic. This localized material distribution optimizes thermal management performance while minimizing overall weight and cost
3Productivity
If interference fit is used to sandwich electronics carrier between housing parts, then assembly speed is improved, but risk of overpressure and damage increases
Solution Approach 1:
The patent incorporates elastic elements (springs, elastomeric materials, or compliant structures) between the housing parts and electronics carrier that act as cushioning elements. These elements are pre-installed to absorb excess compression forces and prevent direct transmission of overpressure to the electronics carrier during assembly
Solution Approach 2:
The attachment mechanism transitions from rigid interference fit to compliant attachment using elastic elements. This changes the mechanical parameters of the connection from rigid and forceful to flexible and pressure-distributing, maintaining assembly speed while reducing peak contact pressures on the electronics carrier
4Measurement precision
If housing parts are joined tightly to ensure optical alignment, then optical precision is improved, but manufacturing tolerance requirements increase
Solution Approach 1:
The patent incorporates alignment features (protrusions, recesses, guide pins, or precision-machined surfaces) into the housing part geometry that pre-establish the correct optical alignment relationship between components. These features are built into the molding or machining process, performing the alignment function during assembly rather than requiring post-assembly adjustment
Solution Approach 2:
The housing assembly is segmented into modular components (first housing part, second housing part, electronics carrier) with standardized interface features. This segmentation allows each component to be manufactured and assembled independently with built-in alignment features, reducing the cumulative tolerance stack-up that would occur in monolithic designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for quick and efficient assembly with reduced complexity and cost, while enhancing heat dissipation, electromagnetic compatibility, and electrostatic discharge protection, ensuring no gaps or misalignment in the housing parts.
Implementation Method 1
The housing assembly and the laser beam are rotated relative to each other about the longitudinal axis such that the laser beam forms an overlap welding along an interface surface defined in the first and second housing parts that are joined to each other
Implementation Method 2
a laser beam is directed to a region of the first and second housing parts... the laser beam forms an overlap welding along an interface surface
Data Source
AI summary
The electronic device comprises a housing assembly extending along a longitudinal axis and comprising a first housing part and a second housing part configured to be joined to each other through an overlap welding, and an electronics carrier received within an inner space of the housing assembly defined when the first and second housing parts are joined to each other.