Camera Module Package Integrating Housing and Board Bonding
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Solution Overview
Problem
Conventional camera module packages face challenges in miniaturization, productivity, and reliability due to the need for wire bonding, increased size, and contamination of external contact terminals by overflowing bonding material during the assembly process.
Innovation Solution
A camera module package design where the housing and board are bonded together simultaneously with the electrical connection of the image sensor, utilizing a contact part with horizontally and vertically formed conductive lines and external contact terminals to eliminate the need for wire bonding and prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect the image sensor and the board, then electrical connection is achieved, but the package size increases and miniaturization is hampered
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the assembly. Instead of using wires to connect the image sensor to the board, the invention integrates the electrical connection function directly into the bonding structure between the housing and board, removing the need for separate wire bonding components and reducing package size.
Solution Approach 2:
The patent merges the mechanical bonding function and electrical connection function into a single integrated process. The bonding structure between the housing and board simultaneously provides both mechanical support and electrical connectivity, eliminating the need for separate wire bonding and reducing overall package complexity and size.
2Strength
If the housing and board are bonded together using bonding material, then mechanical bonding is achieved, but the external contact terminal is contaminated by overflowing bonding material
Solution Approach 1:
The patent introduces an intermediary structure (the integrated bonding contact structure) that mediates between the housing and board. This structure provides a dedicated pathway for electrical contact that is protected from contamination by the bonding material, ensuring reliable electrical connection while maintaining strong mechanical bonding.
Solution Approach 2:
The patent segments the bonding interface into distinct functional zones: one area for mechanical bonding with bonding material, and another area for electrical contact. This segmentation prevents the bonding material from contaminating the electrical contact terminal, maintaining both bonding strength and contact reliability.
3Manufacturing precision
If the assembly process is performed individually for each component, then precise assembly is achieved, but productivity is undermined and manufacturing costs increase
Solution Approach 1:
The patent combines multiple assembly steps into a single integrated process. The housing and board are bonded together in one step that simultaneously establishes both mechanical support and electrical connection, eliminating the need for separate wire bonding and other individual assembly operations, thereby improving productivity while maintaining precision.
4Reliability
If bumps are formed on the image sensor for flip chip bonding, then electrical connection is achieved, but particle defects occur during the process and imaging area is impaired
Solution Approach 1:
The patent extracts and eliminates the bump formation process from the assembly. Instead of forming bumps on the image sensor that can cause particle defects and impair the imaging area, the invention uses an alternative bonding approach that achieves electrical connection without requiring bump formation, thereby maintaining imaging quality.
Data Source
AI summary
There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together.