Camera Module Packaging Structure Reducing Height via Integrated Pedestal
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Solution Overview
Problem
Conventional camera module packaging structures are bulky due to the need for a thick supporting frame, limiting size reduction and efficiency in imaging chip packaging.
Innovation Solution
The proposed solution involves a camera device with an imaging chip packaging structure that includes a ceramic substrate, flip chip mounting of the imaging chip, a flexible circuit board, a reflecting sheet, a packaging pedestal formed via molding on board technology, and a light filter sheet, which reduces the overall height and size by eliminating the supporting frame and enhancing heat dissipation and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If COB technology is used to mount the imaging chip on the printed circuit board, then the imaging chip can be mounted directly, but a thick supporting frame is still required which increases the overall size
Solution Approach 1:
The patent merges the supporting frame function with the printed circuit board by integrating the support structure directly into the PCB layer structure. The first support layer and second support layer are formed as integral parts of the PCB, eliminating the need for a separate thick supporting frame while maintaining structural support for the imaging chip and other components.
Solution Approach 2:
The patent transitions from a three-dimensional thick frame structure to a two-dimensional planar support structure within the PCB layers. By forming support structures within the PCB plane rather than adding vertical thickness, the solution reduces the overall camera module height while maintaining support functionality.
2Stability of the object's composition
If a thick supporting frame is used to support the imaging chip, then structural stability is improved, but the camera module size increases
Solution Approach 1:
The supporting function is merged into the PCB structure itself. The first support layer, second support layer, and insulating layers are integrated into the PCB stack-up, providing structural stability without requiring an external thick frame. The PCB becomes both the circuit carrier and the structural support.
Solution Approach 2:
The patent uses composite layer structures within the PCB, combining different materials with complementary properties. The support layers provide mechanical strength, insulating layers provide electrical isolation, and the imaging chip mounting layer provides precise positioning. This composite approach achieves structural stability with reduced thickness.
3Productivity
If the packaging structure is simplified to reduce size, then manufacturing efficiency improves, but heat dissipation and light filtering capabilities may be compromised
Solution Approach 1:
The PCB structure is designed to perform multiple functions simultaneously: it provides mechanical support, electrical connections, heat dissipation pathways, and light filtering. The insulating layers serve both electrical isolation and thermal management functions, while the integrated structure eliminates the need for separate dedicated heat sink and light shield components.
Solution Approach 2:
The patent combines multiple functional layers into an integrated PCB structure. The support layers, insulating layers, and imaging chip mounting structure are merged into a single multi-layer PCB assembly, reducing the number of separate components while maintaining heat dissipation and light filtering capabilities through the layered construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact camera module design without increasing the overall height, while improving image quality by filtering stray light and protecting the imaging chip, and reduces size in the X-Y directions by integrating the packaging pedestal, thus enhancing the camera's performance and reliability.
Implementation Method 1
a light filter sheet 60, as shown in FIG. 2
Implementation Method 2
enhancing heat dissipation and image quality
Data Source
AI summary
An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.