Vehicle Camera Module PCB Support and EMI Shielding Assembly
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Solution Overview
Problem
The existing camera module assembly process for vehicles is inefficient due to the use of screws, which increases assembly time and can cause optical axis misalignment, and requires additional spacers to maintain PCB spacing, leading to interference issues.
Innovation Solution
A camera module design featuring a first and second PCB with an outer shield and support units, including through holes and tension springs, to securely hold and space the PCBs without additional spacers or screws, while also shielding against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to fix the sensor PCB and power PCB, then the PCBs can be securely fixed, but the assembly time increases and the optical axis may be misaligned due to rotation moment
Solution Approach 1:
The patent removes the screws from the assembly, extracting the fastening function from the traditional screw-based fixing method. The PCBs are fixed without screws, eliminating the assembly time loss and optical axis misalignment issues while maintaining securing strength through alternative means.
Solution Approach 2:
The sensor PCB and power PCB are merged into a single integrated PCB structure. This combination eliminates the need for separate fastening of multiple PCBs, reducing assembly steps and time while preventing optical axis misalignment that would occur with screw fastening during adjustment.
2Strength
If screws are used to fix the PCBs, then the PCBs can be securely fixed, but the mounting area is limited due to screw holes
Solution Approach 1:
The patent extracts the screw holes from the PCB design, removing the area occupied by fastening holes. This increases the available mounting area on the PCBs while maintaining secure fixing through the integrated design and alternative fastening methods.
3Object-affected harmful factors
If spacers are installed to maintain interval between PCBs, then the heat-dissipation and mounting devices can exclude interference, but additional ground processing is required
Solution Approach 1:
The sensor PCB and power PCB are merged into a single integrated PCB that incorporates both heat-dissipation structures and mounting devices. This integration eliminates the need for spacers and the associated ground processing, while still preventing interference between heat-dissipation and mounting components through careful internal layout.
Solution Approach 2:
The integrated PCB serves multiple functions simultaneously: it provides structural support, heat dissipation, electrical connections, and mechanical mounting. This multi-functionality eliminates the need for separate spacers and reduces overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient assembly and spacing of PCBs, reducing assembly time and preventing optical axis misalignment, while effectively shielding against electromagnetic interference.
Implementation Method 1
a tension spring formed by partially bending the sidewall face of the outer shield and configured to support a face where the tension spring faces the support protrusion of the through hole
Implementation Method 2
an outer shield installed to surround the side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI)
Data Source
AI summary
A camera module for a vehicle according to the present invention includes a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface; a second PCB configured to supply a power source to the first PCB; an outer shield installed to surround the side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI); and a plurality of support units disposed at positions where the supports units interfere with the first and the second PCBs of the outer shield and configured to support the first and the second PCBs.