Camera Module PCB Signal Transfer via Exposed Conductive Patterns
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Solution Overview
Problem
In camera modules, conductive vias on signal transfer paths from image sensors can distort signals and complicate pattern design, making it difficult to achieve efficient signal transfer and compact module sizes.
Innovation Solution
The camera module design omits conductive vias on signal transfer paths, using exposed conductive patterns on multiple layers to directly couple the image sensor with external components, reducing signal distortion and simplifying the design process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive vias are used for connection between conductive patterns on different layers, then electrical connection between layers is achieved, but signal distortion occurs and transmission line design becomes complicated
Solution Approach 1:
The patent removes conductive vias from the signal transmission path between the image sensor and the first conductive pattern. By extracting this problematic element, the signal transmission path becomes simpler and signal quality improves, while still achieving electrical connection through alternative means (direct contact between the image sensor pad and the first conductive pattern on the same layer).
Solution Approach 2:
The patent repositions the first conductive pattern from a different layer (requiring via connection) to the same layer as the image sensor. This dimensional repositioning eliminates the need for vertical via connections and simplifies the transmission line design while maintaining electrical connectivity.
2Area of stationary object
If multiple layers are used in PCB for space efficiency, then space utilization improves, but signal transmission path becomes more complex with required via connections
Solution Approach 1:
The patent applies different layer configurations to different functional areas of the PCB. The first conductive pattern is placed on the same layer as the image sensor for simple signal transmission, while other layers can still be used for ground connections, power supply, and other functions. This localized optimization reduces signal path complexity while maintaining space efficiency.
Data Source
AI summary
A camera module is provided and includes an image sensor and a printed circuit board (PCB) structure electrically coupled to the image sensor. The PCB structure may include a first layer disposed under the image sensor, a second layer disposed between the first layer and the image sensor, a first conductive pattern formed on the first layer and electrically coupled to the image sensor through one end portion of the first conductive pattern so as to transfer a signal obtained from the image sensor to an external electronic component, and a first open space formed in the second layer such that the one end portion of the first conductive pattern is exposed to a surface of the PCB structure.