Camera Module PCB Staircase Sill Lens Alignment
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Solution Overview
Problem
Conventional camera module manufacturing methods using epoxy adhesives often result in uneven thickness, leading to vertical tilting and resolution issues, and direct contact between the lens assembly and PCB can cause physical damage to the image sensor, while the adhesive may not provide sufficient strength.
Innovation Solution
A camera module design featuring a staircase sill on the PCB opening edge to guide the lens assembly, with adhesives applied to both horizontal and vertical surfaces for secure attachment, preventing direct contact and ensuring precise optical alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is coated to bond the lens assembly to the PCB, then the lens assembly can be fixed in position, but uneven adhesive thickness causes vertical tilting and resolution degradation
Solution Approach 1:
The patent introduces a dedicated lens assembly support structure (lens holder) as an intermediary component between the lens assembly and PCB. This support structure provides a precise mechanical interface with positioning features (such as recesses and protrusions) that ensure accurate optical alignment, eliminating the reliance on adhesive thickness control for positioning while still using adhesive for secure bonding.
Solution Approach 2:
The patent segments the bonding function from the positioning function. The support structure handles positioning through its geometric design (recesses, protrusions, and mechanical interfaces), while the adhesive is solely responsible for bonding. This segmentation allows each component to optimize its specific function without compromising the other.
2Strength
If adhesive is used to attach the lens assembly, then bonding is achieved, but the adhesive may introduce physical damage to the image sensor during curing
Solution Approach 1:
The support structure acts as a mediator that physically separates the lens assembly from the image sensor during the bonding process. The lens assembly is attached to the support structure, which is then positioned over the image sensor without direct contact, preventing adhesive-related damage to the sensor while maintaining proper optical alignment.
3Volume of moving object
If the adhesive coating surface is narrow, then the assembly is compact, but adhesive strength is insufficient and epoxy may be introduced into the image sensor side
Solution Approach 1:
The patent extends the adhesive bonding surface in the vertical dimension by designing the support structure with bonding surfaces on multiple faces (top surface and side surfaces). This multi-dimensional bonding approach increases the total adhesive bonding area and strength without increasing the horizontal footprint, maintaining compactness while improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The camera module design prevents image sensor damage and facilitates easy optical alignment, maintaining adhesive strength and resolving issues related to uneven adhesive thickness and direct contact.
Implementation Method 1
an adhesive is coated on a horizontal surface unit of the staircase sill and a bottom distal surface of the lens assembly for mutual attachment therebetween
Data Source
AI summary
The present disclosure relates to a camera module including a PCB (Printed Circuit Board, an image sensor and a lens assembly, wherein the PCB formed with an opening, a staircase sill formed at an edge of the opening to insert a lens assembly, and an accommodation structural unit provided at a lower distal end of the opening to insert the image sensor, and wherein the image sensor is assembled to the accommodation structural unit of the PCB, and the lens assembly is inserted into the staircase sill of the PCB for assembly.