Camera Module Pin Connection Layout Without Solder Joints

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional camera modules face issues with increased soldering points between the actuator and module connector, leading to complex manufacturing processes, volume increase of circuit boards, and reliability problems due to defects in the soldering process, impacting electrical and environmental reliability.

Innovation Solution

A camera module design that eliminates the soldering process by using a connection pin to electrically connect a first substrate and a second substrate through a base, with elastic connection parts and a base structure that maintains flatness and rigidity, ensuring reliable electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is used to connect the actuator and module connector, then electrical connection is achieved, but the number of soldering points increases leading to complex manufacturing processes and reliability problems

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the soldering process (mechanical/thermal joining method) with a mechanical connection system using connection pins and elastic connection parts. This substitution eliminates the need for soldering points while maintaining electrical connectivity, thereby reducing manufacturing complexity and improving reliability by avoiding soldering defects.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces connection pins as intermediary elements between the actuator and module connector. These pins serve as mediators that establish electrical connections without requiring direct soldering between components, thus reducing the number of soldering points and simplifying the manufacturing process while maintaining connection reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If more soldering points are used to ensure electrical connectivity, then connection reliability may improve, but the volume of the circuit board increases due to spatial constraints

Engineering Contradiction:

Improveconnection reliabilityVSAvoidcircuit board volume

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent transitions from a planar connection approach (requiring multiple soldering points spread across the circuit board surface) to a vertical connection approach using connection pins that extend through the base. This dimensional change allows electrical connections to be established in the vertical dimension, reducing the horizontal space required and thereby decreasing circuit board volume while maintaining connection reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If soldering is used to connect driving coils and position sensors, then electrical connections are established, but cracks occur at soldering points reducing impact and environmental reliability

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidimpact reliability

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent replaces the soldering process with a mechanical connection system using connection pins and elastic connection parts. This substitution eliminates the formation of soldering joints that are prone to cracking under impact and environmental stress, thereby improving impact reliability and environmental reliability while maintaining electrical connectivity through the mechanical connection structure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent incorporates elastic connection parts that provide inherent flexibility and stress absorption capability. These elastic elements act as beforehand cushioning mechanisms that prevent crack formation by absorbing mechanical stresses and thermal expansions before they can propagate through the connection points, thereby improving impact and environmental reliability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves electrical and physical reliability by eliminating soldering defects, maintains base flatness for infrared filters, and reduces the overall size of the camera module, enhancing operational reliability and design flexibility.

Implementation Method 1

one end of the connection pin contacts the first terminal part, and other end of the connection pin contacts the second terminal part

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

at least one end of the connection pin has elasticity

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentEP4607941A1Camera module and optical device including same

Publication Date: 2025.08.27 LG INNOTEK CO LTD

Figure 1~2
Figure 3
Figure 4

AI summary

A camera module according to an embodiment includes a first substrate having a first terminal part; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device including a second substrate disposed on the base and having a second terminal part; and a connection pin penetrating the base, and wherein one end of the connection pin contacts the first terminal part, and the other end of the connection pin contacts the second terminal part.