Camera Module Planar Sensor-Substrate Layout for Thin Device Integration
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Solution Overview
Problem
Existing camera modules are not suitable for small electronic devices due to their limited minimum thickness, as the laminated semiconductor die and substrate restrict the device's thickness, making it difficult to mount them in thinner devices without interfering with optical image reception.
Innovation Solution
A camera module design featuring a sensor assembly with a semiconductor die, sensor circuit, and transparent cover, positioned alongside semiconductor substrates with through silicon vias and a molding compound to reduce the vertical size, along with a method of manufacturing that includes alternating sensor assemblies and substrates on a carrier layer, filling with molding compound, and dicing to form a monolithic structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is laminated onto the semiconductor substrate with the sensor circuit facing outwards, then the optical sensor can be properly positioned and electrically coupled to the circuit, but the device thickness increases and limits the minimum thickness for use in small electronic devices
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (laminated structure) to a planar side-by-side arrangement. The sensor assembly and semiconductor substrate are positioned horizontally adjacent to each other on the same carrier layer, eliminating the vertical thickness accumulation while maintaining electrical coupling through bonding wires that extend from the bottom surface of the substrate to the through-silicon vias in the sensor assembly.
Solution Approach 2:
The sensor assembly is nested within the molding compound that also encapsulates the semiconductor substrate. The molding compound forms a unified protective structure that integrates both components, allowing them to occupy space efficiently in a planar configuration rather than requiring vertical separation.
2Length of moving object
If the sensor assembly and semiconductor substrate are positioned horizontally adjacent to each other on the same carrier layer, then the device thickness is reduced, but the electrical coupling between the sensor circuit and the substrate circuit becomes more complex
Solution Approach 1:
The sensor assembly is self-contained with the sensor circuit integrated directly on the semiconductor die within the assembly. This integration reduces the need for external wiring and simplifies the coupling mechanism to primarily bonding wires connecting the substrate circuit to the through-silicon vias, rather than requiring complex inter-assembly routing.
Solution Approach 2:
The bonding wires serve as intermediaries that efficiently bridge the electrical connection between the substrate circuit and the sensor assembly through the through-silicon vias. This intermediary approach simplifies the coupling by using proven wire bonding technology rather than attempting direct contact or complex rigid connectors.
3Strength
If the molding compound is used to encapsulate the bonding wires and fill the space between components, then the structural integrity is improved and protection is provided, but the manufacturing process becomes more complex
Solution Approach 1:
The molding compound simultaneously performs multiple functions: it encapsulates and protects the bonding wires, provides mechanical support for both the sensor assembly and semiconductor substrate, fills void spaces to prevent contamination, and creates a unified structural entity. This consolidation of functions into a single material layer simplifies the overall manufacturing approach despite the added encapsulation step.
Solution Approach 2:
The carrier layer is prepared in advance with predetermined spacing and positioning features that guide the placement of sensor assemblies and semiconductor substrates. This preliminary preparation enables automated pick-and-place mounting processes, reducing manual intervention and simplifying the encapsulation process by ensuring proper alignment before molding compound application.
Data Source
AI summary
Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly.