Camera Module Thermal Interface Material for PMIC Heat Dissipation

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Solution Overview

Problem

The increasing complexity of power management in multi-camera electronic devices leads to variable power quality, which can degrade image quality due to heat emitted from power management integrated circuits (PMICs) mounted on camera modules.

Innovation Solution

A camera module design that includes a substrate with multiple cameras, a PMIC generating voltages from an external power supply, and a thermal interface material between the PMIC and a metal fixing member to dissipate heat efficiently, thereby maintaining image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the power management integrated circuit is mounted on the camera module, then power supply stability is improved, but image quality degrades due to heat emission from the PMIC

Engineering Contradiction:

Improvepower supply stabilityVSAvoidheat emission

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A thermal interface material is introduced as an intermediary substance between the PMIC and the metal fixing member. This thermal interface material serves as a thermal conduction medium that transfers heat from the PMIC to the metal fixing member, enabling effective heat dissipation while maintaining the PMIC's stable operation on the camera module substrate

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful thermal energy is extracted from the PMIC through thermal conduction to the metal fixing member. The metal fixing member acts as a heat sink that removes excess heat from the system, preventing heat accumulation that would otherwise degrade image quality

Inventive Principle:

Principle #2Taking out (Extraction)

2Adaptability or versatility

If multiple cameras with high resolution and functions are integrated, then camera functionality is improved, but power consumption increases

Engineering Contradiction:

Improvecamera functionalityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

Multiple camera modules are integrated onto a single substrate, and a unified power management integrated circuit is shared among them. This consolidation approach allows efficient power distribution to multiple high-resolution cameras while managing overall power consumption through centralized power management

Inventive Principle:

Principle #5Merging (Combining)

3Device complexity

If the power management integrated circuit is mounted on the camera module, then power management complexity is reduced, but radiation performance degrades due to heat

Engineering Contradiction:

Improvepower management complexityVSAvoidradiation performance

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The thermal interface material serves as a mediator that enables effective thermal coupling between the PMIC and the metal fixing member. This intermediary layer ensures efficient heat transfer, which directly improves radiation performance by preventing heat-induced degradation while maintaining the integrated power management architecture

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves radiation performance and image quality by effectively managing heat generated by the PMIC, reducing noise and power transmission paths, and enhancing power management within the camera module.

Implementation Method 1

a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11563874B2Camera module and imaging apparatus including the same

Publication Date: 2023.01.24 SAMSUNG ELECTRONICS CO LTD

AI summary

A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.