Camera Module Press-Fit Pins for Multi-Axis Alignment
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Solution Overview
Problem
Existing camera modules for vehicle driver assistance systems face challenges in achieving precise focusing and tilting due to limitations in adjustment mechanisms, such as screw threads and adhesive connections, which can lead to blurry images and long drying times.
Innovation Solution
A camera module design utilizing press-fit pins for mechanical connection between the optics module and circuit carrier, allowing for precise adjustments in multiple axes without affecting stability, and incorporating flexible press-fit pins for fine-tuning with an adjusting machine, along with an adhesive connection for sealing and additional stabilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If adhesive connection is used to mount optics module, then multiple axis adjustment is enabled, but position stability deteriorates due to adhesive expansion/contraction during curing and temperature changes
Solution Approach 1:
The mounting system is segmented into discrete press-fit pins rather than a continuous adhesive bond. Each pin acts as an independent positioning element that can be precisely controlled, eliminating the expansion/contraction issues inherent in adhesive materials while maintaining adjustment capability.
Solution Approach 2:
The patent replaces the chemical/adhesive-based mounting system with a mechanical press-fit pin system. This substitution eliminates the curing process and associated dimensional changes, providing stable mechanical positioning while enabling precise multi-axis adjustment through controlled pin insertion depths and positions.
2Ease of operation
If adhesive connection is used to mount optics module, then multiple axis alignment is achieved, but production time increases due to long drying times in curing oven
Solution Approach 1:
The patent replaces the time-consuming adhesive curing process with an immediate mechanical press-fit connection. The press-fit pins provide instant mechanical stability upon insertion, eliminating the 30-60 minute curing oven time required for adhesive bonds while achieving the same multi-axis alignment precision.
Solution Approach 2:
The press-fit pins are pre-positioned and pre-aligned on the circuit carrier before final assembly. This preliminary positioning ensures that when the optics module is mounted, the multi-axis alignment is already established, requiring only minor adjustments rather than extended curing time for adhesive setting.
3Ease of operation
If screw thread adjustment mechanism is used, then focusing adjustment is enabled, but adjustment capability is limited to single axis only
Solution Approach 1:
The press-fit pin system serves multiple functions simultaneously: it provides mechanical mounting, enables focusing adjustment along the optical axis, and allows tilting adjustment for angular correction. This multi-functional design replaces the single-axis screw thread mechanism with a versatile system that handles all adjustment requirements through pin position and depth variations.
Solution Approach 2:
The patent transitions from one-dimensional screw thread adjustment to three-dimensional press-fit pin positioning. By varying the insertion depth, lateral position, and angle of multiple pins, the system achieves adjustment in multiple dimensions including focusing (axial), tilting (angular), and decentering (lateral), far exceeding single-axis capability.
Data Source
AI summary
A camera module includes a circuit carrier, an image sensor chip arranged on the circuit carrier and an optics module with an optics housing accommodating a lens. Provision is made for the optics housing to be embodied with at least three press-fit pins, the optics housing to be connected to the circuit carrier by way of the three press-fit pins with a predetermined distance from the circuit carrier, wherein the circuit carrier is embodied with at least three press-fit holes for establishing a press-fit connection by the press-fit pins. Furthermore, the invention relates to a method for producing the camera module.