Slim Camera Module with Reinforced Circuit Board
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Solution Overview
Problem
Conventional camera module designs face limitations in achieving slimness while maintaining reliability and image quality, particularly due to the thickness of components like the circuit board and image sensor, which affects the overall height and robustness of the module.
Innovation Solution
A camera module design featuring a lens barrel, housing, IR-cut filter, image sensor mounted in a central window of the circuit board, and a thermal conductive plate for heat dissipation, with a wire bonding connection between the image sensor and circuit board, reducing the overall height and enhancing reliability through improved structural integrity and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the circuit board and image sensor are made thinner to reduce overall module height, then the camera module achieves slimness, but the structural integrity and reliability deteriorate
Solution Approach 1:
The patent employs a composite structure combining a thin circuit board with a separate reinforcement plate (made of metal or other rigid material) that is coupled to the back surface of the circuit board. This composite construction allows the front surface to remain thin for slimness while the backside reinforcement restores structural strength and reliability, resolving the contradiction between reduced height and maintained integrity.
2Ease of manufacture
If conventional COB scheme components are used, then manufacturing is easier, but the camera module cannot achieve slimness
Solution Approach 1:
The patent segments the circuit board structure by introducing a separate reinforcement plate coupled to the back surface, distinct from the main circuit board layer. This segmentation allows independent optimization: the circuit board can be made thin for slimness while the reinforcement plate provides necessary structural support, enabling both reduced thickness and maintained manufacturability through modular assembly.
3Length of moving object
If component thickness is reduced to achieve slim design, then the camera module becomes thinner, but heat dissipation capability worsens
Solution Approach 1:
The reinforcement plate coupled to the back of the thin circuit board serves multiple functions simultaneously: it provides structural reinforcement to maintain reliability in the thinned design, and it acts as a heat sink to improve thermal dissipation from the image sensor and other heat-generating components. This multi-functionality resolves the contradiction between reduced thickness and maintained heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a slim camera module with enhanced reliability and reduced thickness, improved heat dissipation, and cost-effectiveness by minimizing material usage and optimizing component placement, while maintaining image quality and robustness against drops and impacts.
Implementation Method 1
a plate closely adhered and coupled to a lower portion of the circuit board to radiate heat generated from the circuit board
Implementation Method 2
an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal
Implementation Method 3
an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part to remove near infrared wavelengths
Data Source
AI summary
Embodiments of the invention provide a camera module including a lens barrel part in which a plurality of lenses are stacked, a housing having the lens barrel part disposed therein, and an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part. According to at least one embodiment, the camera module further includes a circuit board having a window formed therein so as to penetrate through a central region thereof and supporting a bottom surface of the housing; an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal, and a plate coupled to a lower portion of the circuit board to radiate heat generated from the circuit board.