Camera Module Reinforcement Member for Sensor Alignment

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Solution Overview

Problem

Camera modules in portable devices face challenges in miniaturization and thickness reduction while maintaining image sensor alignment, as metal structures used for reinforcement increase the device's thickness and susceptibility to warping due to external forces and temperature changes.

Innovation Solution

Incorporating a reinforcement member, such as a metal frame, in the same layer as the image sensors and electronic components, and an additional reinforcement plate in the lower portion of the substrate to prevent warping without increasing the module's thickness, while ensuring alignment and structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a metal structure is mounted in the upper or lower portion of the dual camera for alignment and reinforcement, then the image sensor alignment and structural stability are improved, but the thickness of the camera module increases

Engineering Contradiction:
Improveimage sensor alignmentVSAvoidcamera module thickness
Core Design Contradiction:
Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The patent transitions from placing reinforcement structures in the vertical dimension (upper or lower portions increasing thickness) to placing them in the horizontal dimension (same layer as image sensors). The reinforcement member is disposed in the same layer as the first and second image sensors, extending in the horizontal direction to provide alignment and stability without adding vertical thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If a metal structure is mounted in the upper or lower portion of the dual camera for reinforcement, then the structural integrity is improved, but the device becomes more susceptible to warping due to external forces

Engineering Contradiction:
Improvestructural integrityVSAvoidwarping susceptibility
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an additional reinforcement member (reinforcement plate) as an intermediary element disposed on the opposite side of the substrate from the image sensors. This reinforcement plate acts as a mediator that counteracts warping forces, working in conjunction with the first reinforcement member to provide balanced structural support and reduce susceptibility to warping from external forces and temperature changes.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the camera module is miniaturized and slimmed for portability, then the device size is reduced, but the alignment of multiple image sensors becomes more difficult to maintain

Engineering Contradiction:
Improvecamera module sizeVSAvoidimage sensor alignment
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent merges the function of structural reinforcement with the function of alignment reference. The first reinforcement member is disposed in the same layer as the image sensors and includes openings that expose the sensors, thereby serving dual purposes: providing structural support for miniaturization and serving as an alignment reference structure to maintain precise sensor positioning despite the reduced module size.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11032459B2Camera module including reinforcement members for supporting printed circuit board on which plurality of image sensors are disposed and electronic device including the same
Publication Date: 2021.06.08 SAMSUNG ELECTRONICS CO LTD
  • US11032459B2 patent drawing
  • US11032459B2 patent drawing
  • US11032459B2 patent drawing

AI summary

An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.