Camera Module Molding Groove Layout for Complete Resin Filling

The patent applies local quality by making the flow passages have different widths at different locations. Specifically, the first flow passage has a first width and the second flow passage has a second width, where the ratio between these widths is controlled within 0.5:1 to 1:2. This localized variation in geometry allows each flow passage to have optimized flow characteristics appropriate to its position, ensuring uniform filling across the entire molding cavity while avoiding turbulence that would cause lead deformation.

The patent applies parameter changes by controlling the width ratio of the flow passages to be within 0.5:1 to 1:2. This parameter optimization ensures that the packaging material flows at a controlled speed that is fast enough to complete filling within the curing time, yet slow enough to minimize friction with the leads. The optimized dimensions prevent both incomplete filling and lead deformation, resolving the contradiction between filling speed and lead integrity.

The patent applies preliminary action by designing the flow passage dimensions in advance to account for the viscosity changes of the thermosetting packaging material during the molding process. The flow passages are sized to ensure that even as the material viscosity increases during curing, the material can still complete filling of all passages including narrow ones before the curing process terminates the flow. This pre-calculated dimensional design ensures complete filling throughout the entire curing cycle.