Camera Module With Ring-Shaped Protrusions for Capacitor Space Reduction
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Solution Overview
Problem
Existing camera modules are too large to meet ultra-miniaturization design requirements due to the need for space to accommodate capacitors and optical filters, leading to increased design sizes.
Innovation Solution
A camera module design featuring a circuit board with ring-shaped protruding portions, where capacitors are positioned outside these protrusions, and the optical filter is fixed to the protruding portions away from the board body, allowing the base to be partially supported on the capacitors via an adhesive layer, thus reducing the overall size without additional expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are placed on the circuit board with standard spacing, then the camera module can be assembled, but the module size increases due to reserved space for capacitors
Solution Approach 1:
The base merges multiple functions: it supports the lens module, mounts the optical filter, and serves as a support structure for capacitors. By integrating capacitor support into the base rather than requiring separate circuit board space, the design eliminates redundant space reservations while maintaining assembly reliability
Solution Approach 2:
Capacitors are positioned in a different spatial arrangement - outside the protruding portions of the circuit board and supported by the base structure. This dimensional reorganization allows capacitors to be accommodated without increasing the horizontal footprint of the camera module
2Reliability
If the base is designed to wrap around capacitors with safety margins, then assembly interference is prevented, but redundant size is created
Solution Approach 1:
The base design incorporates protruding portions that segment the space around capacitors. These protrusions create natural separation zones that prevent assembly interference without requiring the entire base to be oversized. Each protruding portion locally manages capacitor positioning rather than requiring global base expansion
3Reliability
If optical filter is mounted in the region corresponding to photosensitive chip, then optical path is maintained, but lens base size increases
Solution Approach 1:
The base is designed with non-uniform structure - protruding portions are strategically placed only where needed to support capacitors and position optical filters. This localized structural variation maintains optical path reliability in critical areas while minimizing overall base area by avoiding unnecessary material in non-critical regions
4Strength
If circuit board is glued to lens base with extended coverage, then bonding strength is improved, but outward expansion size increases
Solution Approach 1:
The first adhesive layer serves multiple functions simultaneously: it bonds the base to the circuit board, fills gaps between components, and provides mechanical support for capacitors. By combining these functions into a single adhesive layer rather than requiring separate bonding and support structures, bonding strength is improved without increasing circuit board area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the camera module's size by eliminating the need for additional space for capacitors and optical filters, meeting ultra-miniaturization requirements while maintaining functional integrity.
Implementation Method 1
a first adhesive layer is arranged on a periphery of the base close to the board body, the base is supported and fixed on a periphery of the board body through the first adhesive layer
Data Source
AI summary
The present disclosure discloses a camera module and an electronic device. The camera module includes a circuit board including a board body and at least one ring-shaped protruding portion that is protruded and extended from a part of a side of the board body; a photosensitive chip fixed on the board body and electrically connected with the board body; an optical filter fixed on a side of the at least one protruding portion away from the board body; at least one capacitor fixed on the side of the board body close to the optical filter and electrically connected with the board body; a base defining a mounting space penetrating through the base; and a lens mounted in the mounting space and spaced apart from a side of the optical filter. The camera module of the present disclosure reduces the overall design size and meets the ultra-miniaturization design requirements.