Camera Module Package Screen Printing Electrical Connection
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Solution Overview
Problem
The existing camera module packaging process using chip-on-board (COB) technology is inefficient for high-pixel resolution sensors, leading to increased defects and manufacturing costs due to the sequential connection of pads and exposure to foreign bodies, which hampers yield and price competitiveness.
Innovation Solution
A camera module package design that uses screen printing to electrically connect sensor and external contact pads, eliminating the need for gold wires, with a cavity structure that aligns the image sensor and board to facilitate a flat connection and reduces exposure time, and includes an adhesive for secure placement and a protective filter to prevent foreign body damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If COB packaging with sequential wire bonding is used, then electrical connection between sensor pads and external contacts is achieved, but packaging time increases and productivity decreases
Solution Approach 1:
The patent merges multiple separate wire bonding operations into a single screen printing process. The conductive paste is printed to simultaneously create multiple electrical connections between sensor pads and external contacts in one step, eliminating the sequential nature of traditional wire bonding and dramatically increasing packaging speed while maintaining connection reliability.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a screen printing system. Instead of using wire bonding machines to physically attach individual gold wires, the invention uses screen printing to deposit conductive paste that forms electrical connections, substituting a mechanical process with a more efficient deposition process that achieves the same electrical connection function.
2Reliability
If gold wires are used for electrical connection, then reliable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive gold wires with inexpensive conductive paste material. The conductive paste, which can be based on silver or other cheaper conductive materials, is deposited through screen printing to create the electrical connections, significantly reducing material costs while maintaining the reliability of electrical connection between sensor pads and external contacts.
Solution Approach 2:
The patent changes the material parameter from gold wire to conductive paste. This material substitution, combined with the screen printing deposition method, transforms the electrical connection approach from a high-cost mechanical assembly to a low-cost material deposition process, achieving the same electrical function at reduced manufacturing cost.
3Productivity
If image sensor is exposed to outside environment during packaging, then packaging process can be completed, but defects from foreign bodies increase
Solution Approach 1:
The patent performs the electrical connection operation (screen printing) before the image sensor is fully exposed to the outside environment during subsequent packaging steps. By establishing the electrical connections early in the process while the sensor is still relatively protected, the method minimizes the time the sensor is exposed to potential foreign body contamination, thereby reducing defect rates while maintaining productivity.
4Volume of moving object
If cavity depth matches image sensor thickness for flush alignment, then package size is reduced, but connection precision requirements increase
Solution Approach 1:
The patent replaces the mechanical wire bonding process with screen printing, which is less sensitive to minor alignment variations. The screen printing process can accommodate the flush alignment configuration (where cavity depth matches sensor thickness) because the paste deposition method is more tolerant of positioning variations compared to precise mechanical wire bonding, thereby enabling compact packaging without excessively high precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces packaging time, minimizes defects, lowers manufacturing costs, and enhances product reliability by eliminating gold wires and foreign body exposure, while allowing for collective connection of multiple image sensors, thereby improving productivity and reducing the overall size of the camera module.
Implementation Method 1
a connection part electrically connecting the external contact pad to the sensor contact pad... the connection part is provided using screen printing and covers the sensor contact pad and the external contact pad integrally to electrically connect the sensor contact pad to the external contact pad
Data Source
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AI summary
A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.