Camera Module Sensor Array for 3D Depth Imaging
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Solution Overview
Problem
Current camera modules, especially those using a stereoscopic method for 3D imaging, face limitations such as areas where two cameras cannot capture an object and limited depth levels in the obtained image, hindering the capture of clear 3D images and accurate depth information.
Innovation Solution
A camera module is designed with an array of image sensors and lens units, where the image sensors are mounted on a PCB with WLO lenses, and a shield with windows is used to pass optical images, incorporating a blocking member to prevent spill light and a ground line to isolate each lens unit, allowing for the extraction of 3D images and depth information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If two cameras are used for stereoscopic 3D imaging, then depth information can be obtained, but areas where two cameras cannot capture an object and limited depth levels occur
Solution Approach 1:
The patent divides the imaging system into multiple image sensors (first, second, and third image sensors) arranged in an array configuration. Each sensor captures images from different perspectives, with the third sensor specifically positioned to capture images of areas not visible to the first two sensors. This segmentation of the imaging function across multiple sensors resolves the limitation of coverage area while maintaining depth information accuracy through multi-perspective capture.
2Measurement precision
If multiple image sensors are arrayed to capture more information, then clearer 3D images and accurate depth information can be obtained, but device complexity increases
Solution Approach 1:
The patent merges multiple image sensors into a single array sensor unit that functions as an integrated imaging system. The first, second, and third image sensors are arranged in an array configuration and work together to capture images simultaneously. This merging approach achieves clearer 3D images and accurate depth information while managing device complexity through unified sensor array design rather than separate camera systems.
Solution Approach 2:
The array sensor array serves multiple functions: it captures images for 3D reconstruction, provides depth information through multi-perspective imaging, and extends coverage area beyond what individual sensors can achieve. The shield can with windows also serves dual purposes of protecting the sensors while allowing optical access. This multi-functionality resolves the contradiction by making the complex sensor array worthwhile through its diverse capabilities.
3Illumination intensity
If a shield can with windows is used to pass optical images, then light transmission is improved, but spill light may interfere with image quality
Solution Approach 1:
The patent applies local quality control by positioning blocking members at specific locations where spill light would interfere with the optical path. The blocking members are strategically placed to block stray light while maintaining optical transmission through the shield can windows. This localized intervention resolves the contradiction by allowing light transmission where needed while blocking spill light only in critical interference zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the capture of clearer 3D images and more accurate depth information by utilizing multiple image sensors, minimizing deviations and image degradation, and allowing for parallel or serial data output, even in low light conditions.
Implementation Method 1
a shield can disposed with windows configured to pass an optical image of an object to the plurality of lens units
Implementation Method 2
A blocking member configured to block spill light is interposed between the holder or inner walls of the windows of the shield can and the lens units
Implementation Method 3
solder balls mounted on the other surface of the array sensor. Preferably, but not necessarily, the array sensor may be mounted on a PCB (Printed Circuit Board) by allowing the solder balls to be soldered to the PCB
Data Source
Figure 1~2b
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Figure 6~8
AI summary
An exemplary embodiment of the present disclosure includes an array sensor arrayed with a plurality of image sensors, and a plurality of lens units respectively mounted on the plurality of image sensors.