Camera Module With Sensor Nesting in Circuit Board Chamber
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Solution Overview
Problem
Conventional camera modules are limited in miniaturization due to the need for a large dimension along the axis of the lens module to accommodate the image sensor module, restricting further size reduction.
Innovation Solution
The camera module design includes a lens module, an image sensor module, and a circuit board with a receiving chamber that houses the image sensor module, allowing the lens module to be mounted over the chamber, thereby reducing the overall thickness and volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image sensor module is disposed in a receiving chamber on one side of the lens module, then the image sensor can be properly positioned, but the dimension of the camera module along the lens axis becomes large, limiting miniaturization
Solution Approach 1:
The patent repositions the image sensor module from a location on the optical axis (behind the lens) to a location on the circuit board in a different spatial dimension. The lens module is mounted on the circuit board and covers the receiving chamber, allowing the image sensor to be positioned laterally rather than axially. This dimensional reconfiguration reduces the overall length along the lens axis while maintaining proper optical alignment.
Solution Approach 2:
The image sensor module is nested within the receiving chamber that is defined in the circuit board. The lens module is then mounted on the circuit board and covers the receiving chamber, creating a nested arrangement where the image sensor is housed within the chamber space. This nesting approach efficiently utilizes available space and reduces the overall camera module volume.
2Ease of operation
If a receiving chamber is disposed in the lens module to house the image sensor, then the image sensor is properly positioned, but the overall thickness of the camera module increases
Solution Approach 1:
The receiving chamber is repositioned from the lens module to the circuit board, changing the spatial dimension where the image sensor is housed. Instead of extending the thickness through the lens axis, the chamber is now formed in the circuit board plane. The lens module covers the chamber from above, maintaining proper positioning while reducing overall thickness.
3Manufacturing precision
If the image sensor module is positioned on the optical axis behind the lens, then proper optical alignment is achieved, but the camera module cannot be miniaturized further
Solution Approach 1:
The patent achieves optical alignment without positioning the image sensor on the optical axis behind the lens. Instead, the image sensor is positioned in the receiving chamber on the circuit board, and the lens module is mounted to cover the chamber. This lateral positioning in a different dimension maintains proper optical alignment while enabling miniaturization of the overall module volume.
Data Source
AI summary
A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.