Camera Module Shielding Structure for EMI Reduction
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Solution Overview
Problem
Electromagnetic interference (EMI) between camera modules and other electronic components in electronic devices affects electromagnetic compatibility (EMC), leading to suboptimal performance and interference issues.
Innovation Solution
A camera module with a conductive shielding structure that includes an accommodating portion and a protruding portion, which contacts a conductive external structure, such as a device housing or flange, to enhance electromagnetic compatibility and heat release performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding structure is added to the camera module, then electromagnetic compatibility is improved, but device complexity increases
Solution Approach 1:
The shielding structure is merged with the accommodating portion into a single integrated component. The accommodating portion includes both the image sensor mounting function and the electromagnetic shielding function, eliminating the need for separate shielding structures and reducing overall device complexity while maintaining EMC benefits
Solution Approach 2:
The accommodating portion is designed to serve multiple functions simultaneously: it accommodates the image sensor, provides electromagnetic shielding through its conductive structure, and includes protruding portions that contact the device housing to establish grounding paths. This multi-functionality reduces the total number of components needed
2Temperature
If a conductive shielding structure with protruding portions is used, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation function is merged into the shielding structure by making the accommodating portion conductive. The same structure that provides EMI shielding also serves as a thermal conduction path to the device housing, eliminating the need for separate thermal management components and simplifying manufacturing
Solution Approach 2:
The shielding structure itself serves the dual purpose of EMI shielding and thermal management. The protruding portions that contact the device housing automatically establish both electrical grounding for shielding and thermal conduction paths, without requiring additional dedicated structures for heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure effectively reduces EMI, improving EMC and heat dissipation, thereby enhancing the performance and reliability of camera modules within electronic devices.
Implementation Method 1
a conductive shielding structure configured to shield components of the camera module from electromagnetic interference (EMI)
Implementation Method 2
at least a portion of the external structure being conductive, wherein the shielding structure comprises an accommodating portion configured to accommodate the image sensor, and a protruding portion that protrudes from the accommodating portion, and wherein the protruding portion of the shielding structure contacts the external structure
Data Source
AI summary
An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.