Camera Module Housing Alignment via Solder Ball Guide Grooves
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current camera modules in mobile devices face challenges in aligning the housing and board without compromising the board's rigidity due to mechanical coupling structures and manufacturing tolerances, often requiring holes to be formed in the board.
Innovation Solution
The camera module employs a guide member system with solder balls on the circuit board and corresponding guide grooves in the housing, allowing for precise alignment without drilling holes in the board, using a reflow process to form solder balls that fit into the grooves for alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mechanical coupling structure with protrusion and groove is used to align the housing and board, then alignment function is achieved, but manufacturing tolerance and assembly tolerance are easily generated and board rigidity is decreased due to holes
Solution Approach 1:
The patent replaces the mechanical coupling structure (protrusion and groove) with a solder ball-based alignment system. The solder balls are positioned on the board at specific locations, and the housing has corresponding guide grooves that fit over these solder balls during assembly. This substitution eliminates the need for mechanical holes in the board while maintaining precise alignment through the solder ball positions, thereby preserving board rigidity while achieving accurate alignment.
2Ease of operation
If holes are formed in the board for mechanical coupling, then alignment and coupling are enabled, but board rigidity and utilization are decreased
Solution Approach 1:
The patent substitutes mechanical hole-based coupling with a solder ball positioning system. Solder balls are placed on the board surface at predetermined locations corresponding to guide grooves in the housing. This allows the housing to be aligned and coupled to the board through the guide grooves fitting over the solder balls, eliminating the need for holes in the board and thus preserving its structural integrity and rigidity while enabling effective coupling.
3Ease of manufacture
If mechanical coupling structure is used, then housing and board can be coupled, but manufacturing tolerance is easily generated
Solution Approach 1:
The patent replaces the mechanical protrusion-groove coupling system with a solder ball-guided coupling system. The solder balls are positioned with high precision on the board, and the housing has guide grooves that fit over these solder balls. This substitution provides more stable and precise alignment because the solder ball positions can be accurately controlled during the soldering process, reducing manufacturing tolerance issues compared to mechanical coupling structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the alignment and bonding of the housing and circuit board, improving the camera module's structural integrity and performance while maintaining the board's rigidity and avoiding the need for hole formation.
Implementation Method 1
performing a reflow process on the solder paste; and forming a solder ball from the solder paste
Data Source
AI summary
A camera module includes : a housing in which a lens barrel is accommodated; a circuit board fixedly mounted on a lower portion of the housing; and a guide member guiding a fixing position of the housing fixed to the circuit board, wherein the guide member includes a solder ball, formed on the circuit board to protrude in an upward optical axis direction and a guide groove, provided as a groove recessed in the upward optical axis direction in a lower end portion of the housing and into which the solder ball is fitted.