Camera Module Base Solder Cut-Off and Boss Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of camera modules leads to soldering defects and assembly issues due to manual soldering, causing electrical connection problems and potential contamination of the IR cut-off filter, while the bobbin's repetitive contact with the base can result in damage and foreign object introduction, affecting image quality.
Innovation Solution
The camera module incorporates a solder cut-off part on the base to prevent solder overflow and a reinforced boss design with a non-screw thread section to reduce damage from repetitive contact, featuring a solder cut-off wall or trap to contain excess solder and a chamfered boss for enhanced durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual soldering is used to connect the terminal to the bottom elastic member, then electrical connection is achieved, but solder overflow occurs causing manufacturing defects
Solution Approach 1:
A solder cut-off wall is introduced as an intermediary structure between the terminal and the bottom elastic member. This wall acts as a physical barrier that mediates the soldering process, allowing electrical connection to be achieved while preventing solder from overflowing onto the bottom elastic member, thus resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The base structure is segmented into multiple functional zones: a terminal receiving portion for electrical connection, a solder cut-off wall to contain solder, and a bottom elastic member support area. This segmentation allows each zone to perform its specific function independently, preventing solder overflow while maintaining electrical connectivity
2Volume of moving object
If the camera module is miniaturized to reduce device size, then mobile device compactness is improved, but soldering defects and assembly issues increase
Solution Approach 1:
The terminal is nested within the base structure, with the solder cut-off wall forming an inner cavity that contains the terminal and guides solder flow. This nested arrangement allows compact integration of components while maintaining sufficient space for reliable soldering, thus achieving miniaturization without sacrificing assembly quality
Solution Approach 2:
The base structure exhibits local quality variations: the terminal receiving portion has specific geometric features for connection, the solder cut-off wall provides localized containment, and the bottom elastic member area has appropriate clearance. These localized structural adaptations enable precise assembly in a miniaturized camera module
3Object-affected harmful factors
If the boss size is reduced to prevent interference with the IR cut-off filter, then filter interference is avoided, but the boss becomes more susceptible to damage from repetitive contact
Solution Approach 1:
A buffer portion is designed at the lower end of the boss, providing beforehand cushioning that absorbs impact forces from repetitive contact with the base. This cushioning structure allows the boss to maintain a compact size that avoids filter interference while the buffer portion compensates for the reduced structural strength through elastic deformation
4Reliability
If the bottom elastic member thickness is increased to improve electrical connection, then electrical conductivity is improved, but empty space increases allowing foreign object introduction
Solution Approach 1:
The bottom elastic member is designed as a thin film structure with optimized thickness that provides sufficient electrical conductivity while maintaining flexibility. The elastic properties of this thin film structure allow it to deform and close potential gaps, preventing foreign object introduction while maintaining reliable electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents solder overflow and contamination, enhances the durability of the bobbin's boss, and minimizes damage during auto focusing, ensuring improved camera module performance and image quality.
Implementation Method 1
The bobbin is wound with a coil at a periphery. The coil is electrically connected to the PCB
Implementation Method 2
a terminal of conductive material is soldered to a metal-materialed elastic member to elastically support the bobbin
Data Source
AI summary
A camera module includes a PCB (Printed Circuit Board) installed with an image sensor, a base mounted on the PCB, and a bobbin reciprocatingly mounted above the base. A bottom elastic member is fixed to the base to support the bobbin, and a terminal is installed at the base, one end of which is conductively connected to the PCB and the other end of which is conductively connected to the bottom elastic member at a solder part. A solder cut-off part is formed at the base to cut off movement of overflowing solder from the solder part.