Camera Module Solder Cut-Off and Boss Design

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Solution Overview

Problem

The miniaturization of camera modules leads to soldering defects and assembly issues due to manual soldering, causing electrical connection problems and potential damage to components, while the bobbin's repetitive contact with the base can result in damage and contamination of the IR cut-off filter, affecting image quality.

Innovation Solution

The camera module incorporates a solder cut-off part on the base to prevent solder overflow and a reinforced boss design with a non-screw thread section to reduce damage during auto focusing, featuring a solder cut-off wall or trap to contain excess solder and a chamfered boss for improved durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual soldering is used to connect the terminal to the bottom elastic member, then electrical connection is achieved, but solder overflow occurs causing assembly defects

Engineering Contradiction:

Improveelectrical connectionVSAvoidsoldering quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

A solder cut-off wall is introduced as an intermediary structure between the terminal and the bottom elastic member. This wall acts as a physical barrier that mediates the soldering process, allowing electrical connection to be achieved while preventing solder overflow that would cause assembly defects.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solder cut-off wall is formed in advance on the bottom elastic member before the soldering process. This preliminary action creates a pre-defined boundary that guides and constrains the solder flow during manual soldering, preventing overflow before it can occur.

Inventive Principle:

Principle #10Preliminary action

2Volume of moving object

If the camera module is miniaturized to reduce device size, then mobile device size is decreased, but soldering defects and assembly issues increase

Engineering Contradiction:

Improvecamera module sizeVSAvoidassembly quality

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The solder cut-off wall provides localized structural enhancement at the critical soldering area. Instead of increasing the overall camera module size, the solution applies a local quality improvement by adding a small but functional barrier structure precisely where solder overflow occurs, maintaining miniaturization while improving assembly quality.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If the boss size is reduced to prevent interference with the IR cut-off filter, then filter interference is prevented, but the boss becomes frequently damaged by repetitive use

Engineering Contradiction:

Improvefilter contaminationVSAvoidboss durability

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The boss is designed with a composite structure combining a hard outer layer and a soft inner layer. The hard outer layer provides durability and resistance to damage from repetitive contact, while the soft inner layer allows for cushioning and absorption of impact forces, preventing both boss damage and filter contamination.

Inventive Principle:

Principle #40Composite materials

4Ease of operation

If the bobbin reciprocates in repetitive contact with the base during auto focusing, then auto focusing function is achieved, but the bobbin or base may be damaged

Engineering Contradiction:

Improveauto focusing functionVSAvoidcomponent lifespan

Core Design Contradiction:

Ease of operationVSDuration of action of stationary object

Solution Approach 1:

The soft inner layer of the boss is designed to provide beforehand cushioning during the auto focusing operation. As the bobbin reciprocates and contacts the base, the soft material absorbs and distributes the impact forces, preventing damage to both the bobbin and base while maintaining the auto focusing function throughout the component's lifespan.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents solder overflow and contamination, enhancing the durability of the camera module by minimizing damage to the base and boss, thus maintaining image quality and reducing assembly defects.

Implementation Method 1

a solder cut-off part formed at the base to cut off movement of overflown solder from the solder part

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

In the VCM, a magnet is mounted at a holder member... A bobbin is vertically and reciprocatingly arranged at a position opposite to that of the magnet, where the bobbin is wound with a coil at a periphery

Methodology Applied

Scientific EffectElectromagnetic force: Lorentz Force

Data Source

PatentUS11165943B2Camera module

Publication Date: 2021.11.02 LG INNOTEK CO LTD

AI summary

A camera module includes a PCB (Printed Circuit Board) installed with an image sensor, a base mounted on the PCB, and a bobbin reciprocatingly mounted above the base. A bottom elastic member is fixed to the base to support the bobbin, and a terminal is installed at the base, one end of which is conductively connected to the PCB and the other end of which is conductively connected to the bottom elastic member at a solder part. A solder cut-off part is formed at the base to cut off movement of overflowing solder from the solder part.