Vehicle Camera Module Solder-Jet Assembly for Optical Alignment
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Solution Overview
Problem
Current camera assembly structures for vehicles face challenges in maintaining accurate optical axis alignment due to the use of polymer adhesives, which undergo dimensional changes and have slow curing rates, leading to degradation in quality and productivity, especially at higher operational temperatures, and are susceptible to deformation, affecting the reliability of Advanced Driver Assistance Systems (ADAS).
Innovation Solution
A camera module assembly structure utilizing a laser solder-jet bonding process with Sn-Bi-based solder balls for precise alignment and fixation of the lens and image sensor, allowing for 6-axis optical alignment and ensuring high precision and reliability even at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymer adhesive is used for fixing the lens and image sensor, then the assembly process is simple, but the optical axis alignment accuracy deteriorates due to dimensional changes and slow curing rates
Solution Approach 1:
The patent changes the bonding method from polymer adhesive to laser soldering, fundamentally altering the physical-chemical parameters of the bonding process. This enables instantaneous bonding without dimensional changes, achieving both high precision alignment and manufacturing efficiency
Solution Approach 2:
The patent replaces the chemical bonding mechanism (polymer adhesive curing) with a thermal-metallurgical mechanism (laser soldering). This substitution eliminates the slow curing process and dimensional changes associated with polymer adhesives, achieving instantaneous and precise bonding
2Ease of manufacture
If polymer adhesive is used for fixing, then the initial assembly is easy, but the reliability deteriorates at high temperatures due to adhesive deformation
Solution Approach 1:
The patent changes the bonding material from polymer-based adhesive to metal-based solder, fundamentally altering the thermal stability parameters. This enables the bonding to withstand high temperatures without deformation, achieving both ease of assembly and high temperature reliability
Solution Approach 2:
The patent employs a composite approach by using Sn-Bi-based solder material with specific compositional ratios, combining the benefits of low melting point (for ease of assembly) with high thermal stability (for reliability at elevated temperatures)
3Stability of the object's composition
If polymer adhesive with slow curing rate is used, then the bonding is gentle, but the productivity deteriorates due to extended curing time
Solution Approach 1:
The patent replaces the slow chemical curing process with instantaneous laser-induced melting and solidification. This substitution maintains bonding quality while eliminating the extended curing time, achieving both gentle bonding and high productivity
Solution Approach 2:
The patent uses pulsed laser irradiation to achieve controlled, instantaneous bonding. The periodic nature of the laser pulses allows for precise energy delivery that melts and solidifies the solder rapidly, achieving instantaneous bonding without extended curing times
4Manufacturing precision
If 6-axis optical alignment is performed before fixing, then the alignment precision is improved, but the complexity of the assembly process increases
Solution Approach 1:
The patent performs the 6-axis optical alignment as a preliminary step before the instantaneous laser soldering. This preliminary alignment ensures precise optical axis positioning is achieved and locked in before the bonding process, separating the alignment and bonding operations for clarity and precision
Solution Approach 2:
The patent replaces the complex multi-step adhesive application and curing process with a single instantaneous laser soldering step. This substitution simplifies the overall process complexity while maintaining the necessary 6-axis alignment precision through the preliminary alignment step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser solder-jet bonding process provides instantaneous and precise alignment and fixation, reducing the likelihood of deformation and improving the reliability of ADAS functions by maintaining accurate optical alignment and high-quality image capture, even at temperatures up to 85°C.
Implementation Method 1
a laser solder-jet bonding process
Implementation Method 2
the assembly clearance is soldered and solidified by using a laser solder-jet bonding process
Implementation Method 3
the assembly clearance is soldered and solidified by using a laser solder-jet bonding process
Data Source
AI summary
Provided is a vehicle camera module including a lens, circuit board having an image sensor, front housing, and rear housing. The lens has a lens barrel and lens elements assembled. The front housing has front and rear sides to which the lens and the circuit board are assembled, respectively. The rear housing is coupled rearwardly of the front housing to seal the lens and circuit board. The front housing includes posts protruding rearward and a pin protruding distally of the post and having a smaller cross-sectional area than the post. The circuit board includes a plated through-hole configured to at least partially receive the pin. The front housing and circuit board are pre-assembled such that pin and plated through-hole have an assembly clearance, the lens and image sensor are optically aligned in a pre-assembled state, and the assembly clearance is fixedly soldered through a laser solder-jet bonding process.