Camera Module Spacer Using High-Temp Polymer for Reflow Stability
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Solution Overview
Problem
Camera modules face challenges in maintaining high heat resistance and optical quality, particularly during the reflow process for bonding to a main circuit board, where existing components may deform or allow undesirable light interference.
Innovation Solution
Incorporating a lens assembly with spacers made of polymers like polyimide, polyether ether ketone, polytetrafluoroethylene, or liquid crystal polymer, which provide high heat resistance and optical blocking capabilities, ensuring the camera module's stability and optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing components are used in camera modules, then manufacturing cost is reduced, but heat resistance and optical quality deteriorate during reflow process
Solution Approach 1:
The patent changes the material parameter of the spacer from conventional materials to high-temperature resistant polymers with glass transition temperatures of 140°C to 500°C. This parameter change enables the spacer to maintain dimensional stability and mechanical properties during the reflow process, resolving the contradiction between heat resistance and component stability.
Solution Approach 2:
The patent employs composite material solutions by selecting polymers that combine high heat resistance with optical blocking properties. The spacer is designed as a composite structure that integrates both mechanical support function and optical shielding function, achieving simultaneous improvement in heat resistance and reliability.
2Object-affected harmful factors
If conventional spacers are used, then device complexity is reduced, but optical quality deteriorates due to light interference
Solution Approach 1:
The patent applies the multi-functionality principle by designing the spacer to simultaneously perform three functions: mechanical spacing support, heat resistance during reflow, and optical blocking. This eliminates the need for separate light-blocking structures, maintaining device simplicity while achieving superior optical quality.
Solution Approach 2:
The patent changes the optical parameter of the spacer material by selecting polymers with appropriate absorption characteristics in the visible and infrared ranges. This parameter change enables the spacer to effectively block undesirable light without requiring additional optical elements, resolving the contradiction between light blocking capability and device complexity.
3Temperature
If high-temperature resistant materials are used for spacers, then heat resistance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent selects polymer materials with glass transition temperatures specifically in the 140°C to 500°C range, which provides an optimal balance between heat resistance and manufacturability. These materials maintain dimensional stability during reflow while being compatible with standard manufacturing processes, resolving the contradiction between heat resistance and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The camera module achieves high heat resistance and improved optical characteristics, preventing deformation during the reflow process and effectively blocking undesirable light, thus maintaining mechanical and optical strength without additional housing.
Implementation Method 1
the spacer includes polymer having a glass transition temperature of about 140° C. to about 500° C.
Implementation Method 2
The spacer includes polymer having a glass transition temperature of about 140° C. to about 500° C.
Data Source
AI summary
Disclosed are a lens assembly and a camera module. The lens assembly includes a lens unit and a spacer provided at an upper portion or a lower portion of the lens unit. The spacer includes polymer having the glass transition temperature of about 140° C. to about 500° C.