Camera Module Spring Mounting for Heat Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing camera module connections between the printed circuit board and the objective mount/housing face challenges in achieving a space-optimized, durable, and efficient heat conduction solution, as current methods like adhesive bonding, screwing, and welding either compromise on space, heat transfer, or require additional components.
Innovation Solution
The use of spring elements at opposite connection areas to directly and elastically press the base plate and objective mount together, eliminating the need for screws or adhesives, enhancing heat conduction and providing a compact design with improved sealing and deflection compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonding is used to join the base plate and objective mount, then the connection is simple to implement, but heat conduction between the base plate and objective mount is reduced
Solution Approach 1:
The adhesive layer is completely removed from the connection between base plate and objective mount. Instead, spring elements directly press the two components against each other, eliminating the thermal barrier while maintaining connection simplicity through elastic force application.
Solution Approach 2:
Spring elements serve as intermediary components that transmit mechanical force to press the base plate and objective mount together. These spring elements provide both the connection function and enable direct thermal contact without requiring adhesive materials.
2Strength
If screw connection is used to join the base plate and objective mount, then the connection strength is improved, but additional screw-in depth is required increasing the module size
Solution Approach 1:
The connection transitions from static screw threads to dynamic spring elements that elastically deform to provide clamping force. This allows strong connection without requiring deep engagement, reducing the overall module length while maintaining connection strength through elastic recovery.
Solution Approach 2:
Instead of extending connection depth in the vertical dimension (screw threads), the spring elements utilize lateral elastic deformation to generate clamping force. This dimensionality shift allows strong connection with minimal intrusion into the optical path and reduced module size.
3Strength
If welding or soldering is used to join the base plate and objective mount, then the connection strength is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
Thermal joining processes (welding/soldering) are replaced with a mechanical spring-based clamping system. The spring elements provide sufficient connection strength through elastic force, eliminating the need for complex thermal processes while simplifying manufacturing and reducing costs.
Solution Approach 2:
The connection method changes from permanent thermal bonding to reversible mechanical clamping. By adjusting spring preload and material properties, the connection strength can be optimized without requiring welding or soldering processes, thereby reducing manufacturing complexity.
4Temperature
If spring elements are used to press the base plate and objective mount together, then heat conduction is improved and space is optimized, but additional components are required
Solution Approach 1:
The spring elements serve multiple functions simultaneously: they provide clamping force to maintain connection strength, enable direct thermal contact for heat conduction, and compensate for manufacturing tolerances and thermal expansion. This multi-functionality reduces the need for separate components for each function.
Solution Approach 2:
The connection function and thermal management function are merged into a single spring element system. The same elastic components that provide mechanical clamping also ensure direct thermal contact between base plate and objective mount, eliminating the need for separate adhesive layers or thermal interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a space-optimized camera module with enhanced heat conduction, durability, and reduced assembly complexity, while minimizing installation space and maintaining effective sealing and deflection compensation.
Implementation Method 1
at least one spring element is laterally mounted and positioned at each of at least two connection areas that are oppositely situated with respect to the optical axis of the camera module, via which spring element the base plate and the objective mount are pressed flatly against one another
Implementation Method 2
the base plate and the objective mount rest flatly and directly against one another, so that the heat conduction is significantly improved
Data Source
AI summary
A method for joining a camera module, including a base plate on which an image sensor is situated, and an objective mount in which an objective of the camera module is accommodated. The base plate is placed on the objective mount, and at least one spring element is laterally mounted and positioned at each of at least two connection areas that are oppositely situated with respect to the optical axis of the camera module. The base plate and the objective mount are pressed flatly against one another via the spring element.