Camera Module Stacked Sensor Packaging

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Solution Overview

Problem

The existing packaging structures for camera modules are complex and costly, with the need to prevent particle attachment to image sensing devices, which complicates the manufacturing process and increases costs.

Innovation Solution

A compact packaging structure where the image sensing and signal processing devices are stacked and integrated on one side of the circuit board, with the option of a glass layer directly covering the image sensing device to prevent particle contamination, and a flexible circuit board with a hard plate for enhanced mechanical strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glass cover is used to cover the image sensing device to prevent particle attachment, then the image sensing device is protected from contamination, but the packaging cost increases

Engineering Contradiction:

Improveparticle preventionVSAvoidpackaging cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the traditional glass cover with a flexible protective film that covers the image sensing device. This thin film provides particle protection while being more cost-effective and easier to integrate into the packaging process, directly resolving the contradiction between protection reliability and manufacturing cost

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent integrates the protective function directly into the packaging structure by nesting the image sensing device within the holder that provides both mechanical support and particle protection. This eliminates the need for a separate glass cover, reducing packaging cost while maintaining protection effectiveness

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If the image sensing device and signal processing device are packaged on two sides of the circuit board, then the devices can be properly connected, but the packaging process becomes costly and complex

Engineering Contradiction:

Improvedevice connectionVSAvoidpackaging structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the image sensing device and signal processing device into a single integrated unit mounted on one side of the circuit board. This merging of functions reduces packaging complexity and cost while maintaining proper electrical connections through integrated circuit design

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar two-sided packaging arrangement to a three-dimensional stacked configuration where devices are vertically arranged on one side of the circuit board. This dimensional change reduces the packaging footprint and simplifies the overall structure while maintaining connection reliability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If the image sensing device and signal processing device are packaged on two sides of the circuit board, then the devices can be properly connected, but the packaging cost increases

Engineering Contradiction:

Improvedevice connectionVSAvoidpackaging cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent designs the holder structure to serve multiple functions simultaneously: mechanical support for the integrated device, electrical connection pathway, and particle protection barrier. This multi-functionality reduces the need for separate components, lowering packaging cost while ensuring connection reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7663693B2Camera module

Publication Date: 2010.02.16 UNITED MICROELECTRONICS CORP

AI summary

A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.