Camera Module Steel Sheet Groove for Compact Heat Dissipation
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Solution Overview
Problem
Camera modules face challenges with increased width due to embedded electronic components, poor heat dissipation, and positioning accuracy issues affecting circuit board quality.
Innovation Solution
A camera module design incorporating a steel sheet with recessed grooves to house electronic elements, using a heat conductive paste for improved heat dissipation, and reducing the overall module size while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the electronic component is embedded in the circuit board, then the width of the circuit board can be reduced, but the heat dissipation of the embedded electronic component becomes poor
Solution Approach 1:
The patent transitions from planar embedding to three-dimensional recessed embedding. The groove structure creates a vertical dimension for heat dissipation by allowing heat conductive paste to contact the bottom surface of the groove, enabling heat to dissipate in multiple directions (upward to the circuit board and downward to the paste) rather than being trapped in a two-dimensional plane.
Solution Approach 2:
The heat conductive paste serves as a thermal intermediary between the electronic component and the groove structure. This intermediary material facilitates efficient heat transfer from the component to the surrounding structure, solving the heat dissipation problem while maintaining the compact embedded design.
2Volume of stationary object
If the electronic component is embedded in the circuit board, then the overall module size can be reduced, but the positioning accuracy of the electronic component affects the quality of the circuit board
Solution Approach 1:
The groove structure is pre-formed in the circuit board before the electronic component is installed. This preliminary action creates a predetermined positioning feature that guides and constrains the component during assembly, ensuring accurate placement without requiring high-precision alignment operations during the embedding process itself.
Solution Approach 2:
The groove structure serves as a disposable positioning fixture that is already part of the circuit board. Instead of requiring expensive, high-precision alignment tools or adjustable positioning mechanisms, the design uses a simple pre-formed groove that provides adequate positioning accuracy for standard manufacturing tolerances.
3Temperature
If the electronic component is set around the photosensitive chip, then the heat dissipation may be improved, but the width of the circuit board becomes larger
Solution Approach 1:
The patent moves the electronic component from a lateral arrangement (around the photosensitive chip on the same plane) to a vertical arrangement (recessed into the circuit board below the photosensitive chip). This dimensional change allows heat dissipation to occur through the thickness direction via the groove and heat conductive paste, rather than requiring lateral space that would increase the board width.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation, reduces module size, and improves positioning accuracy, thereby lowering manufacturing costs and increasing yield.
Implementation Method 1
a heat conductive paste is coated on a surface of the electronic element away from the circuit board
Data Source
AI summary
A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.