Camera Module Stumbling Sill for Drop Reliability and Dust Inhibition
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Solution Overview
Problem
The existing camera module designs suffer from reduced drop reliability and dust introduction due to the contacting surface area and electrical noise generated by metallic holders, especially when using conductive epoxy and fine dust is introduced through the structure of the contacting surface.
Innovation Solution
A camera module with a substrate featuring a stumbling sill structure at its outer edge to mount the holder, which enhances drop reliability and prevents dust introduction by grounding the contacting surface, thereby reducing electrical noise and stabilizing the WLO.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a metallic holder is used to reduce electrical noise, then electromagnetic shielding is improved, but drop reliability deteriorates due to increased contacting surface area and conductive epoxy amount
Solution Approach 1:
The holder mounting structure transitions from a broad surface contact to a stepped configuration with multiple levels. The first stumbling sill provides a reduced contact area at a lower position, while the second stumbling sill at a higher position provides additional mounting support, effectively distributing the mechanical load across different spatial dimensions rather than concentrating it on a single large contact surface.
Solution Approach 2:
The holder mounting interface is segmented into multiple discrete contact points through the stepped structure. Instead of a continuous large-area contact between the holder and substrate, the mounting function is divided into separate contact zones at different heights, reducing the total conductive epoxy required while maintaining structural integrity.
2Stability of the object's composition
If a large contacting surface area is used for holder mounting, then mechanical stability is improved, but fine dust intrusion increases through the contacting surface structure
Solution Approach 1:
The mounting structure utilizes vertical dimensionality with stepped levels to achieve mechanical stability without requiring a large horizontal contact area. The first and second stumbling sills at different heights provide distributed support points that ensure stability while minimizing the open surface area where dust could intrude.
Solution Approach 2:
The holder structure acts as a enclosing element that covers and protects the substrate and internal components. By positioning the holder to overhang and cover the stumbling sills, it creates a protective barrier that prevents dust from reaching the contacting surfaces and internal circuitry.
Data Source
AI summary
Disclosed is a camera module including a WLO (wafer level optic) which is manufactured as a wafer optical device; an image sensor which converts an optical signal from the WLO into an electric signal; a holder which functions as a housing of the camera module; and a substrate which has a circuit pattern and transfers the converted electrical signal to a main body, wherein a stumbling sill is formed at an outer edge portion of the substrate so that a lower end of the holder is mounted on the stumbling sill.